Photonics die or integrated photonics modules co-packaged with compute engines have the
potential to deliver significant improvements in power, bandwidth and reach needed to meet …

It has long been known that photonic communication can alleviate the data movement
bottlenecks that plague conventional microelectronic processors. More recently, there has …

Since the CMOS technology scaling has focused on improving digital circuit, the design of
conventional analog circuits has become more and more difficult. To overcome this …

This work presents a hybrid-integrated 4-micro-ring modulator-based wavelength-division
multiplexed (WDM) optical transmitter (OTX) in the O-band, suitable for co-packaged optics …

A flip-chip co-packaged linear transimpedance amplifier (TIA) in 16-nm fin field effect
transistor (FinFET) CMOS demonstrating 112-Gb/s four-level pulse-amplitude modulation (4 …

Optical receivers (ORXs) with integrated CMOS electronics enable compact, low-power
solutions for 400-G Ethernet and co-packaged optics. In this article, we present a 100-Gb/s …

This paper presents a 112 Gb/s PAM4 CMOS linear TIA to meet the requirements of
emerging 400G Ethernet standards for data center interconnect. A regulated inverter-based …

This article presents the first experimental demonstration of an energy-efficient electronic-
photonic co-designed transceiver circuit heterogeneously 3D co-integrated with high …

A linear transimpedance amplifier (TIA) for a 53 GBd PAM-4 optical link to support 100 Gb/s
data on a single wavelength is reported. Designed in a 16 nm FinFET CMOS process, the …

This paper presents a 32 Gb/s non-return-to-zero optical link using 850-nm vertical-cavity
surface-emitting laser-based multi-mode optics with 14-nm bulk FinFET CMOS circuits. The …