Electrochemical deposition of metals onto foreign substrates usually occurs through Volmer–
Weber island growth. The mechanism of island nucleation and growth dictates the shape …

After two decades of intensive development, 3-D integration has proven invaluable for
allowing integrated circuits to adhere to Moore's Law without needing to continuously shrink …

As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …

The influence of the molecular weight (Mw) of polyethylene glycol (PEG) on the microvia
filling by copper electroplating was demonstrated and examined by cross-sectional images …

Copper electrodeposition on copper from still plating solutions of different compositions was
investigated utilising electrochemical impedance spectroscopy (EIS), cyclic voltammetry …

Electrodeposition of copper in the presence of additives mixture that is typically used in"
bottom-up" fill of sub-micrometer vias and trenches on semiconductor wafers is analyzed …

Superconformal electrodeposition is explained by the curvature enhanced adsorbate
coverage (CEAC) mechanism. A CEAC model is used to quantitatively explain shape …

The influence of a catalyst deactivating leveling additive in electrodeposition is explored in
the context of the previously developed curvature enhanced accelerator coverage model of …

An acid-copper plating bath containing chloride ions, polyethylene glycol (PEG), bis (3-
sulfopropyl) disulfide (SPS), and Janus Green B (JGB) has been characterized by …

The impact of branched polyethyleneimine (PEI) on Cu electrodeposition from an acidified
cupric sulfate electtrolyte containing a combination of superfilling additives, specifically …