High aspect ratio silicon etch: A review
B Wu, A Kumar, S Pamarthy - Journal of applied physics, 2010 - pubs.aip.org
High aspect ratio (HAR) silicon etch is reviewed, including commonly used terms, history,
main applications, different technological methods, critical challenges, and main theories of …
main applications, different technological methods, critical challenges, and main theories of …
Formation and behavior of Kirkendall voids within intermetallic layers of solder joints
D Kim, J Chang, J Park, JJ Pak - Journal of Materials Science: Materials in …, 2011 - Springer
The sub-micron void called “Kirkendall void” has been widely observed within intermetallic
compound (IMC) layers in solder joints of semiconductor package interconnections that …
compound (IMC) layers in solder joints of semiconductor package interconnections that …
Versatile On‐Chip Programming of Circuit Hardware for Wearable and Implantable Biomedical Microdevices
Wearable and implantable microscale electronic sensors have been developed for a range
of biomedical applications. The sensors, typically millimeter size silicon microchips, are …
of biomedical applications. The sensors, typically millimeter size silicon microchips, are …
Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging
MG Cho, SK Kang, DY Shih, HM Lee - Journal of Electronic Materials, 2007 - Springer
The effects of Zn additions to Sn-0.7 Cu and Sn-3.8 Ag-0.7 Cu (all in wt.% unless specified
otherwise) Pb-free solders on the interfacial reactions with Cu substrates were investigated …
otherwise) Pb-free solders on the interfacial reactions with Cu substrates were investigated …
Superior mechanical, electrical, dielectric, and EMI shielding properties of ethylene propylene diene monomer (EPDM) based carbon black composites
M Rahaman - RSC advances, 2023 - pubs.rsc.org
In this study, the mechanical, electrical, dielectric, and electromagnetic interference (EMI)
shielding properties of ethylene propylene diene monomer (EPDM) based carbon black …
shielding properties of ethylene propylene diene monomer (EPDM) based carbon black …
High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications
Abstract Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy
for packaging of interconnects in the electronics industry, and high-Ag-content SAC alloys …
for packaging of interconnects in the electronics industry, and high-Ag-content SAC alloys …
Carbon-nanotube through-silicon via interconnects for three-dimensional integration.
Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated
through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT …
through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT …
Effects of Sn grain structure on the electromigration of Sn–Ag solder joints
In this article, we investigated the effect of Sn grain structure on the electromigration (EM)
reliability of Sn–2.5 Ag (wt%) solder joints used in flip-chip packages. The electron …
reliability of Sn–2.5 Ag (wt%) solder joints used in flip-chip packages. The electron …
Thermally conductive boron nitride/SEBS/EVA ternary composites:“processing and characterization”
The aim of this study is to investigate the effect of hexagonal boron nitride (BN) particle
shape/size and loading level on the thermal, mechanical, electrical properties, and …
shape/size and loading level on the thermal, mechanical, electrical properties, and …
Effects of Zn addition on dendritic/cellular growth, phase formation, and hardness of a Sn–3.5 wt% Ag solder alloy
BS Sobral, PS Vieira, TS Lima… - Advanced …, 2023 - Wiley Online Library
Sn–Ag‐based alloys are considered good alternatives to soldering operations as compared
with the traditional Sn–Pb solder alloys. Herein, the effects of 0.5 and 1.0 wt% Zn additions …
with the traditional Sn–Pb solder alloys. Herein, the effects of 0.5 and 1.0 wt% Zn additions …