Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review

Z He, Y Yan, Z Zhang - Energy, 2021 - Elsevier
The electronic equipment develo** towards miniaturization and high integration is facing
the danger of high heat flux and non-uniform temperature distribution which leads to the …

Research progress on structural optimization design of microchannel heat sinks applied to electronic devices

X Zhang, Z Ji, J Wang, X Lv - Applied Thermal Engineering, 2023 - Elsevier
As the miniaturization of electronic devices continues and the heat flux increases rapidly,
thermal management techniques are facing serious challenges. Microchannel heat sinks …

[HTML][HTML] Design modifications in micro pin fin configuration of microchannel heat sink for single phase liquid flow: A review

P Bhandari, KS Rawat, YK Prajapati, D Padalia… - Journal of Energy …, 2023 - Elsevier
Recent technological advancements have led to a drastic increase in heat flux dissipation,
which is a prime factor for lower efficiency and permanent failure. Therefore, cooling …

A review on flow boiling enhancement and fabrication of enhanced microchannels of microchannel heat sinks

D Deng, L Zeng, W Sun - International Journal of Heat and Mass Transfer, 2021 - Elsevier
Rapid increase in heat fluxes within a small area in microelectronic, defense, energy, solar
and medical components has spurred an urgent need for two-phase microchannel heat …

Research progress on passive enhanced heat transfer technology in microchannel heat sink

W Dong, X Zhang, B Liu, B Wang, Y Fang - International Journal of Heat …, 2024 - Elsevier
Enhanced heat transfer technology can be divided into active technology and passive
technology based on whether external power is consumed. Due to the absence of external …

[HTML][HTML] A review of the state-of-the-art in electronic cooling

Z Zhang, X Wang, Y Yan - e-Prime-Advances in Electrical Engineering …, 2021 - Elsevier
The cooling or thermal management issues are facing critical challenges with the
continuous miniaturization and rapid increase of heat flux of electronic devices. Significant …

A critical review of heat transfer enhancement methods in the presence of porous media, nanofluids, and microorganisms

M Habibishandiz, MZ Saghir - Thermal Science and Engineering Progress, 2022 - Elsevier
A current common topic of study among scientists and engineers is how to reduce energy
usage. As the loading power of engineering devices is constantly upgrading, while they are …

Optimization of thermal design of heat sinks: A review

HE Ahmed, BH Salman, AS Kherbeet… - International Journal of …, 2018 - Elsevier
Heat sinks are a kind of heat exchangers used for cooling the electronic devices due to the
simplicity of fabrication, low cost, and reliability of heat dissipation. The extended surfaces …

[HTML][HTML] A review on nanofluids coupled with extended surfaces for heat transfer enhancement

MLG Ho, CS Oon, LL Tan, Y Wang, YM Hung - Results in Engineering, 2023 - Elsevier
Recently, due to the increasing demands for effective and efficient devices, the thermal
sections of modern machinery deserve considerable attention. Researchers in the field of …

On the assessment of the thermal performance of microchannel heat sink with nanofluid

CJ Ho, JK Peng, TF Yang, S Rashidi… - International Journal of …, 2023 - Elsevier
By increasing demands for high thermal performance and energy efficiency, attentions to
microchannel heat sinks (MCHSs) as the suitable method for heat flux dissipation from …