An integrated circuit package is disclosed. The integrated circuit package includes a first
integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the …

ABSTRACT A package may include a first chip having a first surface and a second surface
opposite the first surface; a first redistri bution line (RDL) coupled to the first surface of the …

An integrated circuit (IC) die is disclosed. The IC die can include a signal via extending
through the IC die. The IC die can include a transmission line extending laterally within the …

2023-05-19 Assigned to BANK OF AMERICA, NA, AS COLLATERAL AGENT reassignment
BANK OF AMERICA, NA, AS COLLATERAL AGENT SECURITY INTEREST (SEE …

H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid
state devices; Multistep manufacturing processes thereof all the devices being of a type …

US10269582B2 - Package structure, fan-out package structure and method of the same -
Google Patents US10269582B2 - Package structure, fan-out package structure and method of …

An integrated circuit (IC) die having a first side and a second side opposite the first side is
disclosed. The IC die can include a signal via through the IC die. The IC die can include …

2023-05-03 Assigned to BANK OF AMERICA, NA, AS COLLATERAL AGENT reassignment
BANK OF AMERICA, NA, AS COLLATERAL AGENT SECURITY INTEREST (SEE …

An integrated circuit (IC) chip design for symmetric power delivery includes an integrated
circuit (IC) chip package with I/O connections exposed on a first surface and power …

(Continued) Primary Examiner Khiem D Nguyen (74) Attorney, Agent, or Firm Slater Matsil,
LLP (57) ABSTRACT An embodiment is a device including an integrated circuit die having …