Eutectic bonding of copper to ceramics for thermal dissipation applications–A review
WH Tuan, SK Lee - Journal of the European Ceramic Society, 2014 - Elsevier
Metallic copper, which has low electrical resistivity and high thermal conductivity, is widely
used as an interconnector or substrate within microelectronic packages. If a small amount of …
used as an interconnector or substrate within microelectronic packages. If a small amount of …
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
S Savastiouk, PB Halahan, S Kao - US Patent 7,049,170, 2006 - Google Patents
The present invention relates to attachment of integrated circuits to other integrated circuits
and/or intermediate sub strates. Integrated circuit dies (“chips”) can be attached to a lead …
and/or intermediate sub strates. Integrated circuit dies (“chips”) can be attached to a lead …
Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review
Y Wang, H Liu, L Huo, H Li, W Tian, H Ji, S Chen - Micromachines, 2024 - mdpi.com
With the advancement of Moore's Law reaching its limits, advanced packaging technologies
represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and …
represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and …
Packaging substrates for integrated circuits and soldering methods
S Savastiouk, PB Halahan, S Kao - US Patent 7,060,601, 2006 - Google Patents
“Design Notes: understanding Ball Grid Array Packages' Electronics by Design, www.
electronicsby design. com. au, issue 1997.10, pp. 1-4. Sperling, Ed; Electronic News, Sep …
electronicsby design. com. au, issue 1997.10, pp. 1-4. Sperling, Ed; Electronic News, Sep …
Machine learning aided modelling of thermomechanical fatigue of solder joints in electronic component assemblies
Printed board assemblies, ie components soldered on printed circuit boards (PCBs), are
exposed to thermal cycles responsible for fatigue cracking of solder joints as a result of …
exposed to thermal cycles responsible for fatigue cracking of solder joints as a result of …
Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8 Ag–0.7 Cu solder joints
Intermetallic compound (IMC) growth was investigated under isothermal aging condition at
125° C for up to 500h. The evolution in the IMC morphology and microstructure were …
125° C for up to 500h. The evolution in the IMC morphology and microstructure were …
Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests
Thermal fatigue is one of the main causes of device failure in micro-electro-mechanical
systems (MEMS). Gold wire bonding plays the role of electrical connection and signal …
systems (MEMS). Gold wire bonding plays the role of electrical connection and signal …
Low cycle fatigue models for lead-free solders
Low cycle fatigue (LCF) tests for 95.5 Sn–3.8 Ag–0.7 Cu and 99.3 Sn–0.7 Cu Pb-free
solders were conducted for two conditions of 25° C at 1 Hz and 125° C at 0.001 Hz. The …
solders were conducted for two conditions of 25° C at 1 Hz and 125° C at 0.001 Hz. The …
Can EDA combat the rise of electronic counterfeiting?
The Semiconductor Industry Associates (SIA) estimates that counterfeiting costs the US
semiconductor companies $7.5 B in lost revenue, and this is indeed a growing global …
semiconductor companies $7.5 B in lost revenue, and this is indeed a growing global …
Electromigration induced ductile-to-brittle transition in lead-free solder joints
The effect of electromigration on ductile-to-brittle transition in flip chip solder joints has been
studied using one-dimensional bamboo-type samples of eutectic 95.5 Sn–3.8 Ag–0.7 Cu …
studied using one-dimensional bamboo-type samples of eutectic 95.5 Sn–3.8 Ag–0.7 Cu …