Copper/diamond composites have drawn lots of attention in the last few decades, due to its
potential high thermal conductivity and promising applications in high-power electronic …

Diamond/metal composites are widely used in aerospace and electronic packaging fields
due to their outstanding high thermal conductivity and low expansion. However, the …

Bulk materials with high thermal conductivity are fundamentally important to heat dissipation
of high-power devices. In this study, a record high thermal conductivity of 1021±34 W m− 1 …

Abstract Cu/55 vol% diamond (Ti) composites are prepared by hot forging of cold-pressed
powder preforms, consisted of pure Cu powders and 50 nm-thick Ti-coated diamond …

Thermal boundary conductance is typically positively correlated with interfacial adhesion at
the interface. Here, we demonstrate a counterintuitive experimental result in which a weak …

Abstract Graphene (Gr)/Copper (Cu) composites have shown great potential in thermal-
management and information-transport applications. The influences of interface related …

To unravel the underlying causes of the opposite variation tendency in theoretical and
experimental thermal conductivity of copper/diamond composites as the increasing …

Interfacial thermal resistance plays a critical role in heat dissipation, when the mean free
paths of heat energy carriers approach or exceed the characteristic lengths of devices. Deep …

Abstract Cu–Cr/55 vol% diamond composites with 1 wt%(Cu–1Cr/55Dia), 2 wt%(Cu–
2Cr/55Dia), and 3 wt%(Cu–3Cr/55Dia) Cr additives, respectively, are fabricated by a hot …

Interfacial structure optimization is important to enhance the thermal boundary conductance
(TBC) as well as the overall performance of thermal conductive composites. In this work, the …