In the big data era, Si chips are integrated more and more to satisfy the fast growing demand
from customers. In addition, in the post-COVID-19 virus era, the trend of distance teaching …

We review five solder joint reactions in 3D IC packaging technology which are of wide
interest:(1) Scallop-type growth of Cu 6 Sn 5 in solid-liquid interdiffusion reaction,(2) Whisker …

The development of big data and artificial intelligence technology is increasing the need for
electronic devices to become smaller, cheaper, and more energy efficient, while also having …

In the present era of big data and internet of things, the use of microelectronic products in all
aspects of our life is manifested by the ubiquitous presence of mobile devices as i-phones …

Abstract Different diameter Sn/Cu pillars varying from 30 to 1 μm have been made by focus
ion beam, and the solid state reaction to form Cu 6 Sn 5 in these pillars has been studied. An …

Due to the demand for high-performance electronic products, there has been a rapid
development in three-dimensional integrated circuit (3D IC) packaging technology. The 3D …

In the era of big data, the advantages of 3D packaging are becoming increasingly
significant. In addition, the mismatch between the coefficient of thermal expansion (CTE) of …

Oriented and nanotwinned copper (nt-Cu) of 3.8 µm thickness was electroplated on a Si
wafer substrate for thermal stress measurement from room temperature to 400° C by …

In this study, we designed and electroplated various regular and nanotwinned copper (nt-
Cu) lines. These Cu lines were then covered with a polyimide (PI) layer and heat-treated to …

Electromigration (EM) mechanisms are well studied in damascene copper lines capped with
inorganic dielectrics. However, EM in Cu redistribution lines (RDLs) capped by organic …