This work summarizes the recent progress on the thermal transport properties of 3D
nanostructures, with an emphasis on experimental results. Depending on the applications …

The heat accumulation has become a serious problem due to electronic devices towards
high power and intelligence. Highly thermal conductive and electrical insulating polymeric …

As the power density of the electronics is on increasing, improving the heat dissipation
performance of electronic packaging materials will play a positive role in promoting the …

Polymeric composites with thermally conductive hybrid fillers are significant in the
electronics and thermal dissipation, where thermal transport along with multifunctionality is …

Polymer dielectrics have received increasing attention owing to their wide applications in
electrical, microelectronic and energy storage fields. However, it remains a challenging to …

To restrain dielectric loss while still simultaneously harvesting high dielectric constant (k)
and thermal conductivity (TC) in polymer composites, β-silicon carbide whiskers (β-SiC w) …

As a widely used engineering polymer, epoxy resin has been successfully employed in high-
performance components and setups. However, the poor thermal and friction properties of …

Polymeric composites with the advantages of easy process, light weight and good chemical
resistance were employed in thermal management. The construction of a new type thermal …

The formation of highly thermally conductive composites with a three-dimensional (3D)
oriented structure has become an important means to solve the heat dissipation problem of …

This work reported a novel preparation of waxberry-like calcined alumina/poly
diallyldimethylammonium chloride/diamond (AO*@ ND) via a facile self-assembly of cationic …