In this paper, the effect of annealing condition on the microstructural and mechanical
behavior of copper through-silicon via (Cu-TSV) is studied. The hardness of Cu-TSV scaled …

Liquid‐Phase Deposition of Freestanding Copper Foils and Supported Copper Thin Films and
Their Structuring into Conducting Line Patterns × Close The Infona portal uses cookies, ie …

In this work, a recently developed electron diffraction technique called diffraction scanning
transmission electron microscopy (D-STEM) is coupled with precession electron microscopy …

A Cu-Cu multilayer processed by accumulative roll bonding was deformed to large strains
and further annealed. The texture of the deformed Cu-Cu multilayer differs from the …

In this study, the thermomechanical characteristics of copper through-silicon via (Cu TSV)
structures were studied using synchrotron x-ray microdiffraction, electron backscattered …

We use three-dimensional (3D) grain-continuum models to study grain boundary migration,
treating each grain with anisotropic elastic properties. Grain boundary speeds are computed …

The 3-D integrated circuit technologies with through-silicon via (TSV) structure have been
attracting increasing attentions due to enhanced microchip function and performance …

Increased complexity and functionality in semiconductor devices have placed a greater
emphasis on interconnect routing, where RC (R is resistance and C is capacitance) delay …

Abstract Two-dimensional (2D) graphene has shown great potential of breakthrough of
Moore's law limitation due to its atomic thickness in electronic devices. Up to now, chemical …

Copper interconnects in microelectronics have long been plagued with thermo-mechanical
reliability issues. Control over the copper deposition process and resulting microstructure …