Review of silicon carbide power devices and their applications

X She, AQ Huang, O Lucia… - IEEE transactions on …, 2017 - ieeexplore.ieee.org
Silicon carbide (SiC) power devices have been investigated extensively in the past two
decades, and there are many devices commercially available now. Owing to the intrinsic …

[HTML][HTML] Review of silicon carbide processing for power MOSFET

C Langpoklakpam, AC Liu, KH Chu, LH Hsu, WC Lee… - Crystals, 2022 - mdpi.com
Owing to the superior properties of silicon carbide (SiC), such as higher breakdown voltage,
higher thermal conductivity, higher operating frequency, higher operating temperature, and …

P-type β-gallium oxide: A new perspective for power and optoelectronic devices

E Chikoidze, A Fellous, A Perez-Tomas… - Materials Today …, 2017 - Elsevier
Wide-bandgap semiconductors (WBG) are expected to be applied to solid-state lighting and
power devices, supporting a future energy-saving society. Here we present evidence of p …

[書籍][B] Gallium nitride and silicon carbide power devices

BJ Baliga - 2016 - books.google.com
During the last 30 years, significant progress has been made to improve our understanding
of gallium nitride and silicon carbide device structures, resulting in experimental …

Fluorine-implanted termination for vertical GaN Schottky rectifier with high blocking voltage and low forward voltage drop

S Han, S Yang, K Sheng - IEEE Electron Device Letters, 2019 - ieeexplore.ieee.org
In this letter, fluorine-implanted termination (FIT) has been demonstrated in vertical GaN-on-
GaN Schottky barrier diodes (SBDs). Owing to the unique feature of F ions that can become …

Simulation and experimental study on the junction termination structure for high-voltage 4H-SiC PiN diodes

T Hiyoshi, T Hori, J Suda… - IEEE Transactions on …, 2008 - ieeexplore.ieee.org
Designing and fabrication of 10-kV 4H-SiC PiN diodes with an improved junction termination
structure have been investigated. An improved bevel mesa structure and a single-zone …

Area-efficient bevel-edge termination techniques for SiC high-voltage devices

W Sung, BJ Baliga, AQ Huang - IEEE Transactions on Electron …, 2016 - ieeexplore.ieee.org
This paper reviews the bevel-edge termination techniques for silicon carbide (SiC) power
devices, such as bevel junction termination extension (JTE), resistive-bevel termination …

Characteristics of AlGaN/GaN HEMTs with various field-plate and gate-to-drain extensions

HC Chiu, CW Yang, HC Wang… - IEEE transactions on …, 2013 - ieeexplore.ieee.org
AlGaN/GaN high-electron-mobility transistors (HEMTs) with various field-plate (FP) and gate-
to-drain distance extensions are fabricated and investigated. Experiments are carried out on …

[書籍][B] Vertical GaN and SiC Power Devices

K Mochizuki - 2018 - books.google.com
This unique new resource provides a comparative introduction to vertical Gallium Nitride
(GaN) and Silicon Carbide (SiC) power devices using real commercial device data …

Detailed analysis on determining effective dose for various JTE-based edge terminations utilized on 4H-SiC power devices

N Yun, W Sung - IEEE Transactions on Electron Devices, 2022 - ieeexplore.ieee.org
The article discusses the impact of thermal oxidation process conditions on the implanted
junction-termination-extension (JTE) dose using various edge termination structures for …