A detailed monitoring of atomic-scale processes accomplishing grain rotation is important for
understanding the deformation mechanisms in nanocrystalline metals. However, direct …

A rotary electroplating system was used to fabricate high-strength nanotwinned copper (nt-
Cu) foils with slanted columnar grain structures, which may serve as the anode current …

The current study presents a new microstructure of nanotwinned copper (nt-Cu) with slanted
columnar grains and its correlated mechanical properties. We deposited such nt-Cu foils via …

In this study, we designed and electroplated various regular and nanotwinned copper (nt-
Cu) lines. These Cu lines were then covered with a polyimide (PI) layer and heat-treated to …

The mechanisms of strengthening and plasticity in columnar-grained metals with
preferentially oriented nano-sized twins have been examined traditionally by considering …

In this work, the microstructure evolution during superplastic deformation process and its
impact on superplastic behavior of a peak-aged wrought Mg-10Gd-3Y-1.5 Zn-1Zr (wt%) …

The microstructure of the Cu 6 Sn 5 phase plays a pivotal role in the functionality of
microbumps utilized in 3D packaging. In this study, we present an experimental …

The (111) nanotwinned copper films used as a novel under bump metallization (UBM) were
applied in micro-bump solder technology for 3D packaging. The orientation and morphology …

Copper-to-copper (Cu-to-Cu) direct bonding is a promising approach to replace traditional
solder joints in three-dimensional integrated circuits (3D ICs) packaging. It has been …

Highly (111)-oriented nanotwinned Cu (nt-Cu) films were fabricated on silicon wafers for
thermal-stress characterization. We tailored the microstructural features (grain scale and …