The concept of chemical mechanical planarization (CMP) was invented in IBM in the early
1980s by Klaus D. Beyer in an attempt to create a highly planar surface and enable …

Nanotechnology is a multidisciplinary field that covers a vast and diverse array of devices
and machines derived from engineering, physics, materials science, chemistry and biology …

The quantification and characterization of natural, engineered, and incidental nano-to micro-
size particles are beneficial to assessing a nanomaterial's performance in manufacturing …

As the most basic interconnection metallic material, copper (Cu) has been widely used in
giant-large scale integrated circuits (GLSI). Corrosion inhibitors always play a crucial role in …

This research paper delves into innovative material integration in modern manufacturing,
exploring its potential to elevate US competitiveness within a sustainable global economy. It …

For several decades, chemical mechanical polishing (CMP) has been the most widely used
planarization method in integrated circuits manufacturing. The final polishing results are …

For integrated circuits (IC), as the technology node goes down to 20-14 nm, cobalt (Co)
replaces tantalum as a new barrier layer material. The polishing process of multilayer wiring …

It is a challenge for solid abrasives to control atomic damages. To reduce damage, solid
core and mesoporous shell sSiO 2@ mSiO 2 abrasives were prepared, and novel green …

We demonstrate a quantum gravimeter by combining the advantages of an atom chip for the
generation, delta-kick collimation, and coherent manipulation of freely falling Bose-Einstein …

Due to the soft-brittle, deliquescent, and temperature-sensitive nature, potassium
dihydrogen phosphate (KDP) has become one of the most difficult-to-process materials …