In recent years, electrocatalytic reduction of CO2 has been a focus in the research field.
There are also various methods for synthesizing catalysts, such as the hydrothermal method …

Copper is the most common interconnecting material in the field of microelectronic
packaging, which is widely used in advanced electronic packaging technologies. However …

Pulsed electrocatalysis has emerged as a promising technology to effectively improve
reaction kinetics and tailor product selectivity. While most research focuses on the evolution …

Abstract Highly (111)-oriented nanotwinned Ag (nt-Ag) is a promising candidate for a next-
generation direct metal bonding material without a vacuum environment. However …

Hydrogen peroxide (H2O2) electrosynthesis through 2-electron oxygen reduction reaction
(ORR) is an attractive alternative to the industrial anthraquinone oxidation method …

Traditional efforts in the design of damage-tolerant structural materials were largely
exercises in optimizing the combination of strength and ductility. However, the simultaneous …

The current study presents a new microstructure of nanotwinned copper (nt-Cu) with slanted
columnar grains and its correlated mechanical properties. We deposited such nt-Cu foils via …

Antimony-based alloys have attracted extensive attention as promising anode materials in
sodium-ion batteries (SIBs) due to their high theoretical capacity. However, the current …

Copper plays a key role in electronics, energy, and so on. However, copper faces the
challenge of increasing resistivity with increasing temperature. To overcome this problem …

A kind of new additive for ultra-thin copper foils with high tensile strength is reported in this
work. The highest strength is about 700 MPa with 12 mg/L 2-mercaptothiazoline, and the …