The ever-increasing demands for miniature integrated optics, mechanics, electronics, and
biofluidics have generated great interest in high-performance glass components featuring …

Abstract In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …

In the wake of drawbacks of existing processes, electro chemical discharge machining
(ECDM) is an evolutionary method for the micromachining of glass. However, poor flushing …

Experimental investigation into the effect of tool electrode roughness on the geometric
characteristics of through-holes formed in glass substrate by electrochemical discharge …

The tool electrode feed rate (TEFR) is a parameter of vital importance for velocity-feed
electrochemical discharge drilling (ECDD). The tool electrode will hit the workpiece and may …

Abstract Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass
substrate by a lithography-free process is presented. Through-holes having an opening size …

Continuous demands to develop advanced radio-frequency transmission at higher
frequencies have initiated glass-based materials as a substrate in radio-frequency micro …

This article addresses the gas bubble entrapment issue for the first time when a multi-tip tool
array (MTA) is used in electrochemical discharge machining (ECDM). During the …

An experimental investigation comparing the effect of tool electrode materials on the
formation of microholes in glass by the pulse electrochemical discharge machining is …

Abstract Formation of macro-sized (> 3 mm) through-holes in a 1.1 mm glass substrate by
using a novel tubular electrode having notches in electrochemical discharge machining …