Flip-chip packaging technology is widely employed in various electronic products, and its
thermal performance plays is crucial in determining the overall efficacy of these devices. The …

Purpose This study aims to investigate the impact of indium (In) content on the thermal
properties, microstructure and mechanical properties of Sn-3Ag-3Sb-x In (x= 0, 1, 2, 3, 4, 5 …

Hybrid bonding is an emerging ultra-fine pitch interconnect joining technology for multi-
chip/multi-stack high performance chiplet systems. With sub -μm contact sizes, it is projected …

Chiplets are modular integrated circuits that can be combined to form a larger system,
offering flexibility and performance enhancements. However, their dense packing often …

Purpose The reliability of solder joints is closely related to the growth of an intermetallic
compound (IMC) layer between the lead-free solder and substrate interface. This paper aims …