A health-IoT platform based on the integration of intelligent packaging, unobtrusive bio-sensor, and intelligent medicine box

G Yang, L **e, M Mäntysalo, X Zhou… - IEEE transactions on …, 2014 - ieeexplore.ieee.org
In-home healthcare services based on the Internet-of-Things (IoT) have great business
potential; however, a comprehensive platform is still missing. In this paper, an intelligent …

Impact of scaling on analog performance and associated modeling needs

B Murmann, P Nikaeen, DJ Connelly… - IEEE Transactions on …, 2006 - ieeexplore.ieee.org
This paper explores modeling and technology-scaling issues related to analog performance
in advanced CMOS technologies. Performance metrics for analog circuits are defined, to …

RF CMOS on high-resistivity substrates for system-on-chip applications

K Benaissa, JY Yang, D Crenshaw… - … on Electron Devices, 2003 - ieeexplore.ieee.org
The use of a high-resistivity substrate extends the capability of standard digital CMOS
technology to enable the integration of high-performance RF passive components. The …

Digital RF processing: Toward low-cost reconfigurable radios

K Muhammad, RB Staszewski… - IEEE Communications …, 2005 - ieeexplore.ieee.org
RF circuits for multi-gigahertz frequencies have recently migrated to state-of-the-art low-cost
digital CMOS processes. This article visits fundamental techniques recently developed that …

Heterogeneous integration of bio-sensing system-on-chip and printed electronics

L **e, G Yang, M Mantysalo, LL Xu… - IEEE Journal on …, 2012 - ieeexplore.ieee.org
In this paper, we present a heterogeneous integration platform for bio-sensing applications,
which seamlessly integrates low-power silicon-based circuits with cost-effective printed …

Ultrawide frequency range crosstalk into standard and trap-rich high resistivity silicon substrates

KB Ali, CR Neve, A Gharsallah… - IEEE Transactions on …, 2011 - ieeexplore.ieee.org
Substrate crosstalk into standard and trap-rich high-resistivity silicon (HR-Si) substrates over
a wide frequency range, from ultralow frequency (ULF) to extremely high-frequency band …

Advanced CMOS technology portfolio for RF IC applications

CS Chang, CP Chao, JGJ Chern… - IEEE transactions on …, 2005 - ieeexplore.ieee.org
A high quality 90-nm CMOS-based technology portfolio suitable for various RF IC
applications is presented. The portfolio is built up by a wide selection of active and passive …

RF SOI CMOS technology on 1st and 2nd generation trap-rich high resistivity SOI wafers

BK Esfeh, S Makovejev, D Basso, E Desbonnets… - Solid-State …, 2017 - Elsevier
In this work three different types of UNIBOND™ Silicon-on-Insulator (SOI) wafers including
one standard HR-SOI and two types of trap-rich high resistivity HR-SOI substrates named …

Cellular handset integration-SIP versus SOC

W Krenik, DD Buss, P Rickert - IEEE journal of solid-state …, 2005 - ieeexplore.ieee.org
Cellular handsets are rapidly evolving from voice-only products to highly featured designs
featuring color displays, games, audio, video, cameras, Bluetooth, GPS, WLAN, high-speed …

An outlook on the evolution of mobile terminals: from monolithic to modular multiradio, multiapplication platforms

G Desoli, E Filippi - IEEE Circuits and Systems Magazine, 2006 - ieeexplore.ieee.org
Terminals, including traditional cellular phones, have historically been optimized for a small
number of services over a specific network. With the convergence of consumer electronics …