The electronic equipment develo** towards miniaturization and high integration is facing
the danger of high heat flux and non-uniform temperature distribution which leads to the …

Gas turbines are widely used in the areas of air propulsion, electric power generation, ship
propulsion, external driving units, and other industrial applications. Efficient coating and …

Targeted at addressing practical thermal issues of 3D-IC chip, heat transfer characteristics
and temperature uniformity of gradient distribution solid and annular-cavity micro-pin fins are …

Thermal hotspots cause excessive localized temperature rise, leading to significant
temperature gradients across the microprocessor, which is the primary reason for its …

Targeted at improving microfluidic cooling for the use of micro heat sink in electronic chips, a
novel fin-shaped pin-fin array heat sink is proposed. In this study, the mechanism of flow and …

Facing the challenge of high heat flux in electronic devices, effective heat dissipation with
low consumption has drawn great attention. Based on the constructal theory, the optimal …

Multilevel inverter switches (MIS) present a thermal management challenge by virtue of their
small size yet high power operation. In this contribution, a water-cooled heat sink for an MIS …

With the high energy output of electronic devices, effective heat dissipation with low energy
consumption has drawn great attention. Based on the construction theory, the flow …

To enhance heat and fluid exchange between main flow and near-wall flow in
microchannels, a twisted blade-like fin with an advantage in stimulating both spanwise and …

As electronic devices become smaller, they need modern and efficient heat removal
solutions. One such solution is microchannel arrays, where the flow around the pin-fins …