Polymer composites have progressively found applications in sectors such as automotive,
aerospace and energy storage. Their high performance can be mainly attributed to their …

As microelectronics technology advances towards miniaturization and higher integration, the
imperative for develo** high-performance thermal management materials has escalated …

Polymer-based thermal interface materials (TIMs) with good comprehensive properties
remains a severe challenge for the advanced electronics. Herein, the vertically aligned …

In the pursuit of effective thermal management for electronic devices, it is crucial to develop
insulation thermal interface materials (TIMs) that exhibit exceptional through-plane thermal …

With the development of high power‐density electronic devices on smaller scales and
emerging new energy vehicles, high thermal conductive materials have attracted more …

In this work, we report a facile preparation of the composite resin with significantly enhanced
high in-plane or through-plane thermal conductivity via controlling the layer thickness of …

The characteristics of fillers (such as size, geometry, composition, and content) and their
spatial distribution states have significant impacts on thermal conductivity (TC) of polymeric …

Recently, the use of fused deposition modeling (FDM) in the three-dimensional (3D) printing
of thermal interface materials (TIMs) has garnered increasing attention. Because fillers orient …

A fluid-assisted fused deposition modeling (FA-FDM) 3D printing technique was proposed
and employed to create anisotropically thermally conductive polymer composites (aniso …

In recent years, the demand direction for electronic equipment has expanded into
embedded and miniaturized devices. The heat radiation problem has become one of the …