SRAM stability analysis and performance–reliability tradeoff for different cache configurations

R Zhang, T Liu, K Yang, CC Chen… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
Bias temperature instability (BTI), hot carrier injection (HCI), gate-oxide time-dependent
dielectric breakdown (GTDDB), and random telegraph noise (RTN) degrade the stability of …

Memory and logic lifetime simulation systems and methods

L Milor, T Liu, CC Chen - US Patent 10,514,973, 2019 - Google Patents
Aspects of the disclosed technology include a method including extracting, by a processor, a
plurality of features from one from among a layout of a circuit, a netlist of the circuit, and the …

Performance Degradation Analysis and Hot-Carrier Injection Impact on the Lifetime Prediction of Voltage Control Oscillator

CH Ho, KA Jenkins, H Ainspan, E Ray… - … on Electron Devices, 2015 - ieeexplore.ieee.org
This paper analyzes the root cause of performance degradation and the impact of hot-carrier
injection (HCI) on the lifetime prediction of an LC voltage-controlled oscillator (LC-VCO) …

Reliability analysis of spintronic device based logic and memory circuits

Y Wang - 2017 - pastel.hal.science
Spin transfer torque magnetic tunnel junction (STT-MTJ) has been considered as a
promising candidate for next generation of non-volatile memories and logic circuits, because …

Processor-level reliability simulator for time-dependent gate dielectric breakdown

CC Chen, T Liu, S Cha, L Milor - Microprocessors and Microsystems, 2015 - Elsevier
Time-dependent gate dielectric breakdown (TDDB) is a leading reliability concern for
modern microprocessors. In this paper, a framework is proposed to analyze the impact of …

A physics-based statistical model for reliability of STT-MRAM considering oxide variability

CH Ho, GD Panagopoulos, SY Kim… - … on Simulation of …, 2013 - ieeexplore.ieee.org
A physics-based statistical model considering oxide thickness (T ox) variability is proposed
for evaluating the impact of time-dependent dielectric breakdown (TDDB) on the …

Negative bias temperature instability and gate oxide breakdown modeling in circuits with die-to-die calibration through power supply and ground signal …

S Cha, T Liu, L Milor - IEEE Transactions on Very Large Scale …, 2017 - ieeexplore.ieee.org
With the scaling of CMOS technology, negative bias temperature instability (NBTI) and gate
oxide breakdown (GOBD) are serious issues for transistors. Normally, degradation due to …

Modeling for SRAM reliability degradation due to gate oxide breakdown with a compact current model

R Zhang, T Liu, K Yang, L Milor - 2017 32nd Conference on …, 2017 - ieeexplore.ieee.org
Gate oxide breakdown (GOBD) degrades the performance of SRAMs. In this paper, a
modeling methodology for SRAM reliability degradation due to GOBD is implemented with a …

Statistical SBD modeling and characterization and its impact on SRAM cells

SY Kim, CH Ho, K Roy - IEEE Transactions on Electron …, 2013 - ieeexplore.ieee.org
In this paper, we present a physics-based SPICE model for statistical soft breakdown (SBD)
in ultrathin oxide. Statistical SBD induces an increase in gate leakage current (IG_BD) …

Gate oxide breakdown parameter extraction with ground and power supply signature measurements

S Cha, W Kim, L Milor - Design of Circuits and Integrated …, 2014 - ieeexplore.ieee.org
Gate oxide breakdown (GOBD) is a serious reliability issue for MOS transistors. Wearout due
to GOBD is traditionally modeled based on test structure data. In this paper, we present a …