High entropy alloys (HEAs) are remarkable engineering materials with a unique structural
design and diverse properties, making them widely applicable. This review focuses on their …

Lead-free solder research has witnessed a great jump in the past decades due to the
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …

Annealing-induced hardening, also known as anneal hardening, has been often observed
in cold-worked solid solution alloys. Here, we report a peculiar case of annealing-induced …

Brazing fillers for joining applications are essential for manufacturing and designing
advanced materials. Several types of brazing fillers have been developed in recent decades …

In the post-Moore era, advanced packaging is becoming more critical to meet the everlasting
demands of electronic products with smaller size, more powerful performance and lower …

Polydopamine (PDA) has been extensively investigated due to its excellent adhesion ability
and versatile chemical potential for secondary reactions. However, the potential application …

High entropy alloys (HEAs) have attracted substantial attention in diverse fields, including
hydrogen storage, owing to their unique structural and functional properties. The diverse …

Graphene is widely used as a barrier at the solid–solid and gas–solid state interface.
However, the use of graphene as a barrier at the liquid–solid interface has been rarely …

Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for
achieving high-density integration, high-speed connectivity, and for downsizing of electronic …

Due to its moderate mechanical properties, low neutron absorption, excellent processability,
superior irradiation, and corrosion resistance, as well as good compatibility with nuclear fuel …