Nanometric cutting: mechanisms, practices and future perspectives

F Fang, M Lai, J Wang, X Luo, J Yan, Y Yan - International Journal of …, 2022 - Elsevier
Nanometric cutting removes material at nanoscale and generates high-quality surfaces with
a nanometric finish. In past decades, it has thrived as a mainstream manufacturing …

Advances in laser assisted machining of hard and brittle materials

K You, G Yan, X Luo, MD Gilchrist, F Fang - Journal of Manufacturing …, 2020 - Elsevier
Hard and brittle materials (HBMs) are promising materials for aerospace and astronomy
applications, due to their excellent mechanical, optical, and chemical properties. However …

Manufacturing and measurement of freeform optics

FZ Fang, XD Zhang, A Weckenmann, GX Zhang… - Cirp Annals, 2013 - Elsevier
Freeform optics is the next-generation of modern optics, bringing advantages of excellent
optical performance and system integration. It finds wide applications in various fields, such …

Diamond machining of silicon: a review of advances in molecular dynamics simulation

S Goel, X Luo, A Agrawal, RL Reuben - International Journal of Machine …, 2015 - Elsevier
Molecular dynamics (MD) simulation has enhanced our understanding about ductile-regime
machining of brittle materials such as silicon and germanium. In particular, MD simulation …

Surface generation of tungsten carbide in laser-assisted diamond turning

K You, F Fang, G Yan - International Journal of Machine Tools and …, 2021 - Elsevier
The removal mechanism of conventional cutting and in-process-heat laser-assisted cutting
(In-LAC) of binderless polycrystalline tungsten carbide (WC) material is studied through …

A review of surface roughness generation in ultra-precision machining

SJ Zhang, S To, SJ Wang, ZW Zhu - International Journal of Machine Tools …, 2015 - Elsevier
Ultra-precision machining (UPM) is capable of manufacturing a high quality surface at a
nanometric surface roughness. For such high quality surface in a UPM process, due to the …

Review of ductile machining and ductile-brittle transition characterization mechanisms in precision/ultraprecision turning, milling and grinding of brittle materials

AR Alao - Precision Engineering, 2024 - Elsevier
Brittle materials are applied in optical, semi-conductor, electronic and medical industries. To
meet the industrial requirements, excellent surface quality is desired, requiring ductile mode …

Tool-based micro machining and applications in MEMS

FZ Fang, K Liu, TR Kurfess, GC Lim - MEMS/NEMS: Handbook …, 2006 - Springer
Advances in product miniaturization leads to size and weight reduction which can
substantially increase the convenience and value of many products [1, 2]. Micro-Electro …

Brittle–ductile transition during diamond turning of single crystal silicon carbide

S Goel, X Luo, P Comley, RL Reuben, A Cox - International Journal of …, 2013 - Elsevier
In this experimental study, diamond turning of single crystal 6H-SiC was performed at a
cutting speed of 1m/s on an ultra-precision diamond turning machine (Moore Nanotech 350 …

Modelling and experimental investigation on nanometric cutting of monocrystalline silicon

FZ Fang, H Wu, YC Liu - International Journal of Machine Tools and …, 2005 - Elsevier
A new model to understand the behaviour of how materials are removed from workpiece in
nano cutting is proposed. This model postulates that the mechanism of nanometric scale …