Glass-LTCC-Interposer, a New Plattform for HF-Applications

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[HTML][HTML] Low insertion loss interposer approach for RF applications based on commercial LTCC tape, alkaline-free glass and printed metallization

H Bartsch, M Kaltwasser, K Karimi, J Müller - Materials Research Bulletin, 2024 - Elsevier
Materials with high RF performance are in increasing demand due to the needs of modern
telecommunications. Glass and low-temperature co-fired ceramics (LTCCs) are both …
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Glass and Glass/LTCC interposers as heterogenous integration platform

J Müller, M Kaltwasser, H Bartsch… - 2024 Pan Pacific …, 2024 - ieeexplore.ieee.org
Glass as substrate or interposer material is gaining more and more interest due to its thin
film compatibility and thus high-density integration capability. Multilayer stacks for processor …
Сачувај Цитирај 2 пута наведен Сродни чланци