High-Efficient Vacuum Ultraviolet-Ozone Assist-Deposited Polydopamine for Poly(lactic-co-glycolic acid)-Coated Pure Zn toward Biodegradable Cardiovascular Stent …

H Fang, X Qi, S Zhou, S Yang, C Hang… - … Applied Materials & …, 2021 - ACS Publications
Zinc is a prospective metal for biodegradable cardiovascular stent applications, but the
excessively released Zn2+ during degradation remains a huge challenge in …

Robust and flexible free-standing polyimide/SiOx nanocomposite one-dimensional photonic crystals with high reflectance

X **, X Guo, L Zhai, F Vogelbacher, Y **a, M Li… - Journal of Materials …, 2023 - Springer
Flexible free-standing one-dimensional photonic crystals (1DPCs) have attracted
tremendous attentions owing to the simplest structure and promising applications in various …

Organic-inorganic solid-state hybridization with high-strength and anti-hydrolysis interface

TH Yang, CR Kao, A Shigetou - Scientific Reports, 2019 - nature.com
Organic-inorganic material hybridization at the solid-state level is indispensable for the
integration of IoT applications, but still remains a challenging issue. Existing bonding …

[HTML][HTML] Low-temperature direct hybrid bonding of polypropylene to natural rubber and Cu by methyl glycine vapor-assisted vacuum ultraviolet (MG-VUV) method …

A Shigetou, N Hosoda - Materials Letters, 2022 - Elsevier
We realized direct bonding of polypropylene (PP) to natural rubber and Cu at temperatures
below 100° C without vacuum, while maintaining surface hydrophobicity. We developed …

Polyimide-polyetheretherketone and tin-polyimide direct bonding via ethanol-assisted vacuum ultraviolet irradiation

TH Yang, YS Chiu, CY Yang, A Shigetou… - Transactions of The …, 2019 - jstage.jst.go.jp
Joining of dissimilar materials is extremely important for flexible electronic packaging, which
is generally achieved by assembly of pre-patterned electronic components into multi-layered …

[PDF][PDF] 紫外光活化低温键合研究进展

王晨曦, 戚晓芸, 方慧, 康秋实, 周诗承, 许继开… - 机械工程 …, 2022 - qikan.cmes.org
随着电子及生物医疗元器件朝着微型化, 便携式及多功能性的发展, 连接(电子领域内常被称为“键
合”) 已成为材料或结构一体化集成不可或缺的关键环节. 表面活化键合避免了传统焊接工艺中的 …

Direct bonding method for completely cured polyimide by surface activation and wetting

Y Meng, R Gao, X Wang, S Huang, K Wei, D Wang… - Materials, 2022 - mdpi.com
Polymer adhesives have emerged as a promising dielectric passivation layer in hybrid
bonding for 3D integration, but they raise misalignment problems during curing. In this work …

A single process for homogeneous and heterogeneous bonding in flexible electronics: Ethanol-assisted vacuum ultraviolet (E-VUV) irradiation process

TH Yang, CY Yang, A Shigetou… - … on Electronics Packaging …, 2019 - ieeexplore.ieee.org
Joining of dissimilar materials is extremely important for flexible electronic packaging, that is
generally achieved by assembly of pre-patterned electronic components with organic …

Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation

TH Yang, CR Kao, A Shigetou - 2018 International Conference …, 2018 - ieeexplore.ieee.org
To integrate electronic devices and structural materials for divers IoT applications, low
temperature solid-state organic-inorganic is crucially important. Here we evaluate feasibility …

[PDF][PDF] Research Progress on Ultraviolet Activated Low-temperature Bonding

王晨曦, 戚晓芸, 方慧, 康秋实, 周诗承, 许继开… - Journal of Mechanical … - qikan.cmes.org
With the diversification of electronic devices and bio-components functions, the integration of
multi-materials or structures has become an integral part of device manufacturing. Reliable …