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Advanced InP photonic integrated circuits for communication and sensing
Similar to the area of microelectronics, InP-based photonic integrated circuits (PICs) in the
optical domain as a counterpart are also seeing a clear exponential development. This rapid …
optical domain as a counterpart are also seeing a clear exponential development. This rapid …
Wafer-scale hybrid integration of InP DFB lasers on Si photonics by flip-chip bonding with sub-300 nm alignment precision
InP DFB lasers are flip-chip bonded to 300 mm Si photonic wafers using a pick-and-place
tool with an advanced vision system, realizing high-precision and high-throughput passive …
tool with an advanced vision system, realizing high-precision and high-throughput passive …
Indium phosphide photonic integrated circuits: Technology and applications
A summary of photonic integrated circuit (PIC) platforms is provided with emphasis on
indium phosphide (InP). Examples of InP PICs were fabricated and characterized for free …
indium phosphide (InP). Examples of InP PICs were fabricated and characterized for free …
Thermal analysis of InP lasers transfer printed to silicon photonics substrates
The thermal performance of Fabry-Perot InP lasers integrated onto different silicon photonics
substrates by microtransfer printing is assessed. 500-μm-long ridge waveguide lasers on the …
substrates by microtransfer printing is assessed. 500-μm-long ridge waveguide lasers on the …
Thermal characterisation of hybrid, flip-chip inp-si dfb lasers
WA detailed thermal analysis of a hybrid, flip-chip InP-Si DFB laser is presented in this work.
The lasers were experimentally tested at different operating temperatures, which allowed for …
The lasers were experimentally tested at different operating temperatures, which allowed for …
Preparation of Highly Thermally Conductive Hexagonal Boron Nitride‐Polyvinyl Alcohol/Polydimethylsiloxane Composite Using Combined Freeze‐Drying and Spatial …
N Li, S Qiu, Q Du, Y An, Y Chen, Y Li… - Advanced …, 2024 - Wiley Online Library
With the rapid advancement of electronic products, an increasing number of electronic
components are being integrated onto chips, leading to a higher power consumption per …
components are being integrated onto chips, leading to a higher power consumption per …
Inclined emitting slotted single-mode laser with 1.7° vertical divergence angle for PIC applications
Y Zhang, Y Su, Y Bi, J Pan, H Yu, Y Zhang, J Sun… - Optics letters, 2017 - opg.optica.org
In this Letter, a new type of single-mode slotted laser used for an on-chip light source in
photonic integrated circuits is proposed. An inclined light beam with a low vertical …
photonic integrated circuits is proposed. An inclined light beam with a low vertical …
[HTML][HTML] Strain-compensated InGaAsP superlattices for defect reduction of InP grown on exact-oriented (001) patterned Si substrates by metal organic chemical vapor …
We report on the use of InGaAsP strain-compensated superlattices (SC-SLs) as a technique
to reduce the defect density of Indium Phosphide (InP) grown on silicon (InP-on-Si) by Metal …
to reduce the defect density of Indium Phosphide (InP) grown on silicon (InP-on-Si) by Metal …
Large-area direct hetero-epitaxial growth of 1550-nm ingaasp multi-quantum-well structures on patterned exact-oriented (001) silicon substrates by metal organic …
We employ a simple two-step growth technique to grow large-area 1550-nm laser structures
by direct hetero-epitaxy of III–V compounds on patterned exact-oriented (001) silicon (Si) …
by direct hetero-epitaxy of III–V compounds on patterned exact-oriented (001) silicon (Si) …
Flip-chip III-V-to-silicon photonics interfaces for optical sensor
We demonstrate flip-chip solder assembly of InP chips on Silicon-Photonic (Si-Ph)
substrates aimed at high volume manufacturing using typical microelectronic lead-free …
substrates aimed at high volume manufacturing using typical microelectronic lead-free …