With the rapid development of modern industry, there is an urgent need for copper alloys
with high strength and high conductivity (HSHC). Unfortunately, the HSHC of metals are …

Integrated circuits (ICs) are challenged to deliver historically anticipated performance
improvements while increasing the cost and complexity of the technology with each …

A major challenge for the continued downscaling of integrated circuits is the resistivity
increase of Cu interconnect lines with decreasing dimensions. Alternative metals have the …

The electron mean free path λ and carrier relaxation time τ of the twenty most conductive
elemental metals are determined by numerical integration over the Fermi surface obtained …

Grain boundaries (GBs) in metals usually increase electrical resistivity due to their distinct
atomic arrangement compared to the grain interior. While the GB structure has a crucial …

We report on the thin film resistivity of several platinum-group metals (Ru, Pd, Ir, and Pt).
Platinum-group thin films show comparable or lower resistivities than Cu for film thicknesses …

Armed with the merits of one-dimensional nanostructures (flexibility, high aspect ratio, and
anisotropy) and metals (high conductivity, plasmonic properties, and catalytic activity), metal …

A scanning electron microscope (SEM) provides real-time imaging with nanometer
resolution and a large scanning area, which enables the development and integration of …

Many properties of materials are incompatible with each other or even completely exclusive.
Here, we proposed a new concept in view of the trade-off paradox of material properties …

The electron scattering at surfaces, interfaces, and grain boundaries is investigated using
polycrystalline and single-crystal Cu thin films and nanowires. The experimental data is …