Flexible organic photodetectors and their use in wearable systems

H Guo, S Saifi, K Fukuda, HM Cheng, Z Lou… - Digital Signal …, 2022 - Elsevier
Flexible organic photodetectors that are lightweight, conformable, cost-effective, and
compatible with large-scale processing techniques will meet the demands of next …

Nanomembrane-assembled nanophotonics and optoelectronics: From materials to applications

J Huang, G Huang, Z Zhao, C Wang… - Journal of Physics …, 2022 - iopscience.iop.org
Nanophotonics and optoelectronics are the keys to the information transmission technology
field. The performance of the devices crucially depends on the light–matter interaction, and it …

Mechanically guided post‐assembly of 3D electronic systems

BH Kim, F Liu, Y Yu, H Jang, Z **e, K Li… - Advanced Functional …, 2018 - Wiley Online Library
This paper describes deterministic assembly processes for transforming conventional,
planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D …

ZnO film flexible printed circuit board pH sensor measurement and characterization

PH Yang, CT Chan, YS Zhang - IEEE Access, 2022 - ieeexplore.ieee.org
An electrochemical zinc oxide (ZnO) pH sensor is proposed and prototyped using a flexible
printed circuit board (FPCB). The device is resistant to acidic and alkaline solutions and …

Comparison of tensile and fatigue properties of copper thin film depending on process method

HG Min, DJ Kang, JH Park - Applied Sciences, 2020 - mdpi.com
In this study, tensile and fatigue tests were performed and analyzed to evaluate an influence
of fabrication method on mechanical characteristics of copper thin film which widely used in …

Thermal fluid-structure interaction in the effects of pin-through-hole diameter during wave soldering

MSA Aziz, MZ Abdullah, CY Khor… - Advances in …, 2014 - journals.sagepub.com
An effective simulation approach is introduced in this paper to study the thermal fluid-
structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the …

FPCB micromirror-based laser projection availability indicator

H Zuo, S He - IEEE Transactions on Industrial Electronics, 2016 - ieeexplore.ieee.org
This paper presents a flexible printed circuit board (FPCB) actuator-driven micromirror
(referred to as FPCB micromirror hereafter)-based laser projection indicator. The device …

Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology

CY Khor, MZ Abdullah - Simulation modelling practice and theory, 2012 - Elsevier
Optimized design of the integrated circuit (IC) package gives better IC encapsulation
process and minimizes the stress concentration and deformation of the IC structures. The …

Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

EES Ong, MZ Abdullah, CY Khor, WK Loh… - Microelectronic …, 2014 - Elsevier
This paper presents the effect of chip stacking in a 3D integrated circuit package during
plastic encapsulation. An experiment was conducted on four stacked chips with bumps in a …

Thermomechanical analysis of the stretchable serpentine heaters considering finite deformation

Z Zhao, Y Yin, X Fan, Y Li - Composite Structures, 2022 - Elsevier
Stretchable heater, as a newly developed heating device, can perfectly fit with
undevelopable curved surfaces via mechanical deformation. Inspired by serpentine …