The progressively decreasing feature size of the circuit components has tremendously
increased the need for the global surface planarization of the various thin film layers that …

Chemical mechanical planarisation (CMP) is a polishing process used in the fabrication of
silicon wafers to achieve a globally planar wafer surface. The removal of material from the …

Precision surfaces of optical grade have been in great demand for various applications such
as high-power laser systems, astronomical reflecting telescopes glass mirrors, folding …

Diamond is one of the hardest and most difficult to polish materials. In this paper, the
polishing of {111} and {100} single crystal diamond surfaces by standard chemical …

Interaction of silica and silicon nitride with polyurethane surfaces is rather poorly studied
despite being of great interest for modern semiconductor industry, eg, for chemical …

In this article, a new approach is applied to reuse Artemisia residue (AR) as filler in
polyurethane (PU) foam for vegetable oil sorption for discarded cooking oil applications. The …

The effect of polishing an optical workpiece with a polyurethane pad was studied in this
paper, including material removal rate, surface roughness and subsurface damage. Usually …

A diamond pad conditioner or dresser is required to regenerate the asperity structure of a
pad used in chemical mechanical polishing (CMP). A conventional diamond dresser (CDD) …

Dynamic mechanical analysis (DMA) was used to obtain dynamic moduli of a standard
industrial polishing pad before and after chemical–mechanical polishing (CMP). The …

Polyurethane polishing pads are important in chemical mechanical polishing (CMP). Thus,
understanding how to decrease the density but increase the porosity is a crucial aspect of …