Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas
Printed circuit boards (PCBs) are difficult to recycle because of the layered structure of non-
metal (ie, epoxy resin, glass fiber) and copper. In this work, we conducted a systematic …
metal (ie, epoxy resin, glass fiber) and copper. In this work, we conducted a systematic …
[PDF][PDF] Modelling of thermal stresses in printed circuit boards
O Šuba, L Sýkorová, Š Šanda, M Staněk - 13th WSEAS International …, 2011 - smtnet.com
Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the
article. It is shown that thermal stress alone is not solely caused by differences in coefficients …
article. It is shown that thermal stress alone is not solely caused by differences in coefficients …
Mathematic model of heat transport in materials during cutting process
D Janáčová, P Mokrejš, V Vašek, R Drga… - Annals of DAAAM …, 2015 - publikace.k.utb.cz
Printed circuit boards (PCBs) that represent a significant part of electronic waste are
potential sources of material and energy. In the paper we focused on study of a cutting as an …
potential sources of material and energy. In the paper we focused on study of a cutting as an …
Modelling of Transient Thermal Stress in Layered Walls
O Šuba, L Sýkorová, M Malachová… - Manufacturing …, 2010 - journalmt.com
Results of FEM modelling of transient thermal stress analysis in layered walls are given in
the article. It is shown that thermal stress alone is not solely caused by differences in …
the article. It is shown that thermal stress alone is not solely caused by differences in …
[書籍][B] Modeling of grinding process by printed circuit boards recycling
H Charvatova - 2010 - daaam.info
In the paper we deal with the printed circuit boards recycling problem. We focuse on study of
a grinding as an alternative method of conductive ways from plastic board separation as one …
a grinding as an alternative method of conductive ways from plastic board separation as one …
[PDF][PDF] Modeling of printed circuit boards separation by cutting
D Janacova, H Charvatova… - Proceedings of the …, 2011 - researchgate.net
In the paper we deal with the printed circuit boards recycling problem. We focused on study
of a cutting as an alternative method of conductive ways from plastic board separation as …
of a cutting as an alternative method of conductive ways from plastic board separation as …
[PDF][PDF] Computer modeling of non-stationary conduction of heat in two-layer plate
H Charvátová, V Vašek, P Mokrejš… - Recent Researches in …, 2011 - academia.edu
In this paper we deal with study of a heat transport process in solids. Especially we focused
on a problem of non-stationary conduction of heat in a two-layer plane plate. For this …
on a problem of non-stationary conduction of heat in a two-layer plane plate. For this …
Study of non-stationary temperature fields in printed circuit boards during separation by cutting
Nowadays, growth of electronic waste represents serious global problem. Therefore, ways of
its recycling are searched. In the paper we deal with the printed circuit boards recycling. We …
its recycling are searched. In the paper we deal with the printed circuit boards recycling. We …
[PDF][PDF] Modelling of Transient Thermal Stress in Layered Walls
D Sámek - MANUFACTURING TECHNOLOGY - adoc.pub
Modelling of Transient Thermal Stress in Layered Walls Page 5 vol. X., December 2010
MANUFACTURING TECHNOLOGY–ABSTRACTS ISSN 1213-2489 ISBN 978-80-7414-325-0 5 …
MANUFACTURING TECHNOLOGY–ABSTRACTS ISSN 1213-2489 ISBN 978-80-7414-325-0 5 …
[PDF][PDF] Software application for solving of non-stationary temperature fields in a plane plate
In this paper we present software application that we programmed for study of heat transfer
problems that is a part of education of subject Process engineering taught at the Tomas Bata …
problems that is a part of education of subject Process engineering taught at the Tomas Bata …