Architecture of computing system based on chiplet

G Shan, Y Zheng, C **ng, D Chen, G Li, Y Yang - Micromachines, 2022 - mdpi.com
Computing systems are widely used in medical diagnosis, climate prediction, autonomous
vehicles, etc. As the key part of electronics, the performance of computing systems is crucial …

[HTML][HTML] Using chiplet encapsulation technology to achieve processing-in-memory functions

W Tian, B Li, Z Li, H Cui, J Shi, Y Wang, J Zhao - Micromachines, 2022 - mdpi.com
With the rapid development of 5G, artificial intelligence (AI), and high-performance
computing (HPC), there is a huge increase in the data exchanged between the processor …

Llama: A heterogeneous & serverless framework for auto-tuning video analytics pipelines

F Romero, M Zhao, NJ Yadwadkar… - Proceedings of the ACM …, 2021 - dl.acm.org
The proliferation of camera-enabled devices and large video repositories has led to a
diverse set of video analytics applications. These applications rely on video pipelines …

Shef: Shielded enclaves for cloud fpgas

M Zhao, M Gao, C Kozyrakis - Proceedings of the 27th ACM International …, 2022 - dl.acm.org
FPGAs are now used in public clouds to accelerate a wide range of applications, including
many that operate on sensitive data such as financial and medical records. We present …

Application defined on-chip networks for heterogeneous chiplets: An implementation perspective

T Wang, F Feng, S **ang, Q Li… - 2022 IEEE International …, 2022 - ieeexplore.ieee.org
With the help of advanced packaging technologies to integrate multiple chips (eg, CPU, AI,
IO), a chiplet-based SoC design process can enable fast system construction. However, the …

GIA: A reusable general interposer architecture for agile chiplet integration

F Li, Y Wang, Y Cheng, Y Wang, Y Han, H Li… - Proceedings of the 41st …, 2022 - dl.acm.org
2.5 D chiplet technology is gaining popularity for the efficiency of integrating multiple
heterogeneous dies or chiplets on interposers, and it is also considered an ideal option for …

Enabling micro AI for securing edge devices at hardware level

H Wang, H Sayadi, SMP Dinakarrao… - IEEE Journal on …, 2021 - ieeexplore.ieee.org
Emerging embedded systems and Internet-of-Things (IoT) devices, which account for a wide
range of applications are often highly resource-constrained that are challenging the software …

Intelligent codesign strategy for thermal management and cost control of 3-D integrated system with TTSV

D Chen, X Wang, Y Yang, D Li… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
The intelligent codesign strategy is proposed to balance the thermal management and cost
control for 3-D integrated system with thermal through-silicon via (TTSV). The complex …

A generator of numerically-tailored and high-throughput accelerators for batched GEMMs

L Ledoux, M Casas - 2022 IEEE 30th Annual International …, 2022 - ieeexplore.ieee.org
We propose a hardware generator of GEMM accelerators. Our generator produces vendor-
agnostic HDL describing highly customizable systolic arrays guided by accuracy and energy …

Configurable network protocol accelerator (copa)

V Krishnan, O Serres, M Blocksome - IEEE Micro, 2020 - ieeexplore.ieee.org
Today's field-programmable gate arrays (FPGAs) offer not only programmable acceleration
capabilities but also include advanced features that are on-par with a mainstream processor …