The exploration of 2D materials has captured significant attention due to their unique
performances, notably focusing on graphene and hexagonal boron nitride (h‐BN) …

Layered transition metal hydroxides (LTMHs) with transition metal centers sandwiched
between layers of coordinating hydroxide anions have attracted considerable interest for …

The development of MoS 2-based devices presents a significant challenge due to the poor
interfacial thermal transport of metal-MoS 2-dielectric structures, which results in severe …

Thermally conductive films are essential interface materials placed between a heat source
and a heat sink to address the heat dissipation issue, especially for electronic devices …

Phononic waveguides (PnWGs) are devices with rationally designed periodic structures to
manipulate mechanical oscillations and to engineer and control the propagation of acoustic …

Flexible electronic devices with skin-like properties are hailed as revolutionary for the
development of next-generation electronic devices, such as electric-skin and humanoid …

With the continuous miniaturization, integration, and stacking of chips, how to effectively
dissipate heat at nanoscale has become a pressing challenge. The previous studies toward …

Low‐dimensional thermoelectric materials systems are proven to possess improved
thermoelectric performance, either by enhancing the power factor S2σ through quantum …

The rapid development of communication technology has put new demands on high-
efficiency microwave absorbing materials. In this study, silicon carbide particles are totally …

Two-dimensional graphene has emerged as a promising competitor to silicon in the post-
Moore era due to its superior electrical, optical, and thermal properties. However, graphene …