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Status and prospects of cubic silicon carbide power electronics device technology
Wide bandgap (WBG) semiconductors are becoming more widely accepted for use in power
electronics due to their superior electrical energy efficiencies and improved power densities …
electronics due to their superior electrical energy efficiencies and improved power densities …
Nanoscale transport properties at silicon carbide interfaces
Wide bandgap semiconductors promise devices with performances not achievable using
silicon technology. Among them, silicon carbide (SiC) is considered the top-notch material …
silicon technology. Among them, silicon carbide (SiC) is considered the top-notch material …
Surface and interface issues in wide band gap semiconductor electronics
Wide band gap (WGB) materials are the most promising semiconductors for future electronic
devices, and are candidates to replace the conventional materials (Si, GaAs,…) that are …
devices, and are candidates to replace the conventional materials (Si, GaAs,…) that are …
[HTML][HTML] Genesis and evolution of extended defects: The role of evolving interface instabilities in cubic SiC
Emerging wide bandgap semiconductor devices such as the ones built with SiC have the
potential to revolutionize the power electronics industry through faster switching speeds …
potential to revolutionize the power electronics industry through faster switching speeds …
Towards vertical Schottky diodes on bulk cubic silicon carbide (3C-SiC)
In this paper, we demonstrate the feasibility of fabricating vertical Schottky diodes on bulk
cubic silicon carbide (3C-SiC) material obtained by combining sublimation epitaxy and …
cubic silicon carbide (3C-SiC) material obtained by combining sublimation epitaxy and …
Thermal sensing capability and current–voltage–temperature characteristics in Pt/n-GaP/Al/Ti Schottky diodes
H Efeoǧlu, A Turut - Journal of Vacuum Science & Technology B, 2023 - pubs.aip.org
We have discussed the thermal sensing capability under a constant current level and current
versus voltage (I–V) traces by measuring the temperature of high series resistance Pt/n …
versus voltage (I–V) traces by measuring the temperature of high series resistance Pt/n …
Lateral enlargement growth mechanism of 3C-SiC on off-oriented 4H-SiC substrates
V Jokubavicius, GR Yazdi, R Liljedahl… - Crystal growth & …, 2014 - ACS Publications
We introduce a 3C-SiC growth concept on off-oriented 4H-SiC substrates using a
sublimation epitaxial method. A growth model of 3C-SiC layer development via a controlled …
sublimation epitaxial method. A growth model of 3C-SiC layer development via a controlled …
Evidence of electrical activity of extended defects in 3C–SiC grown on Si
In this paper, we demonstrate the high electrical activity of extended defects found in 3C–
SiC heteroepitaxially grown layer on (100) silicon substrates. Cross-sectional scanning …
SiC heteroepitaxially grown layer on (100) silicon substrates. Cross-sectional scanning …
An experimental study: Dependence of Schottky diode parameters on Schottky contact area size
H Efeoǧlu, A Turut, M Gül - Optical Materials, 2023 - Elsevier
We have investigated whether the Schottky barrier diodes (SBD) parameters such as the SB
height and ideality factor (IF) change as a function of Schottky contact (SC) area, in the Pt/n …
height and ideality factor (IF) change as a function of Schottky contact (SC) area, in the Pt/n …
The origin and nature of killer defects in 3C-SiC for power electronic applications by a multiscale atomistic approach
3C-SiC epitaxially grown on Si displays a large wealth of extended defects. In particular,
single, double and triple stacking faults (SFs) are observed to coexist in several …
single, double and triple stacking faults (SFs) are observed to coexist in several …