Status and prospects of cubic silicon carbide power electronics device technology

F Li, F Roccaforte, G Greco, P Fiorenza, F La Via… - Materials, 2021 - mdpi.com
Wide bandgap (WBG) semiconductors are becoming more widely accepted for use in power
electronics due to their superior electrical energy efficiencies and improved power densities …

Nanoscale transport properties at silicon carbide interfaces

F Roccaforte, F Giannazzo… - Journal of Physics D …, 2010 - iopscience.iop.org
Wide bandgap semiconductors promise devices with performances not achievable using
silicon technology. Among them, silicon carbide (SiC) is considered the top-notch material …

Surface and interface issues in wide band gap semiconductor electronics

F Roccaforte, F Giannazzo, F Iucolano, J Eriksson… - Applied Surface …, 2010 - Elsevier
Wide band gap (WGB) materials are the most promising semiconductors for future electronic
devices, and are candidates to replace the conventional materials (Si, GaAs,…) that are …

[HTML][HTML] Genesis and evolution of extended defects: The role of evolving interface instabilities in cubic SiC

G Fisicaro, C Bongiorno, I Deretzis… - Applied Physics …, 2020 - pubs.aip.org
Emerging wide bandgap semiconductor devices such as the ones built with SiC have the
potential to revolutionize the power electronics industry through faster switching speeds …

Towards vertical Schottky diodes on bulk cubic silicon carbide (3C-SiC)

F Roccaforte, G Greco, P Fiorenza, S Di Franco… - Applied Surface …, 2022 - Elsevier
In this paper, we demonstrate the feasibility of fabricating vertical Schottky diodes on bulk
cubic silicon carbide (3C-SiC) material obtained by combining sublimation epitaxy and …

Thermal sensing capability and current–voltage–temperature characteristics in Pt/n-GaP/Al/Ti Schottky diodes

H Efeoǧlu, A Turut - Journal of Vacuum Science & Technology B, 2023 - pubs.aip.org
We have discussed the thermal sensing capability under a constant current level and current
versus voltage (I–V) traces by measuring the temperature of high series resistance Pt/n …

Lateral enlargement growth mechanism of 3C-SiC on off-oriented 4H-SiC substrates

V Jokubavicius, GR Yazdi, R Liljedahl… - Crystal growth & …, 2014 - ACS Publications
We introduce a 3C-SiC growth concept on off-oriented 4H-SiC substrates using a
sublimation epitaxial method. A growth model of 3C-SiC layer development via a controlled …

Evidence of electrical activity of extended defects in 3C–SiC grown on Si

X Song, JF Michaud, F Cayrel, M Zielinski… - Applied Physics …, 2010 - pubs.aip.org
In this paper, we demonstrate the high electrical activity of extended defects found in 3C–
SiC heteroepitaxially grown layer on (100) silicon substrates. Cross-sectional scanning …

An experimental study: Dependence of Schottky diode parameters on Schottky contact area size

H Efeoǧlu, A Turut, M Gül - Optical Materials, 2023 - Elsevier
We have investigated whether the Schottky barrier diodes (SBD) parameters such as the SB
height and ideality factor (IF) change as a function of Schottky contact (SC) area, in the Pt/n …

The origin and nature of killer defects in 3C-SiC for power electronic applications by a multiscale atomistic approach

E Scalise, L Barbisan, A Sarikov, F Montalenti… - Journal of Materials …, 2020 - pubs.rsc.org
3C-SiC epitaxially grown on Si displays a large wealth of extended defects. In particular,
single, double and triple stacking faults (SFs) are observed to coexist in several …