Semiconductor supply chain resilience and disruption: Insights, mitigation, and future directions
W **ong, DD Wu, JHY Yeung - International Journal of Production …, 2024 - Taylor & Francis
In recent years, the semiconductor supply chain has experienced dramatic changes, due to
geopolitical tensions and public health events, which have provided insights into supply …
geopolitical tensions and public health events, which have provided insights into supply …
Recent advances in deep-learning-enhanced photoacoustic imaging
Photoacoustic imaging (PAI), recognized as a promising biomedical imaging modality for
preclinical and clinical studies, uniquely combines the advantages of optical and ultrasound …
preclinical and clinical studies, uniquely combines the advantages of optical and ultrasound …
Anomaly detection in additive manufacturing processes using supervised classification with imbalanced sensor data based on generative adversarial network
Supervised classification methods have been widely utilized for the quality assurance of the
advanced manufacturing process, such as additive manufacturing (AM) for anomaly …
advanced manufacturing process, such as additive manufacturing (AM) for anomaly …
An attention-augmented convolutional neural network with focal loss for mixed-type wafer defect classification
Silicon wafer defect classification is crucial for improving fabrication and chip production.
Although deep learning methods have been successful in single-defect wafer classification …
Although deep learning methods have been successful in single-defect wafer classification …
Semi-supervised imbalanced classification of wafer bin map defects using a Dual-Head CNN
S Manivannan - Expert Systems with Applications, 2024 - Elsevier
Abstract Wafer Bin Map (WBM) defect patterns are a critical aspect of identifying the root
cause of manufacturing defects in the semiconductor industry. Semi-supervised learning …
cause of manufacturing defects in the semiconductor industry. Semi-supervised learning …
Attention-based Fusion Network for Breast Cancer Segmentation and Classification Using Multi-modal Ultrasound Images
Y Cho, S Misra, R Managuli, RG Barr, J Lee… - Ultrasound in Medicine & …, 2024 - Elsevier
Objective Breast cancer is one of the most commonly occurring cancers in women. Thus,
early detection and treatment of cancer lead to a better outcome for the patient. Ultrasound …
early detection and treatment of cancer lead to a better outcome for the patient. Ultrasound …
New method of measuring the permittivity of silicon wafer, with relevance to permittivity-based quality sensing
DDL Chung, DQ Duong - Materials Chemistry and Physics, 2023 - Elsevier
A new method of measuring the permittivity of silicon wafers is provided. It removes the
previously reported dependence of the measured permittivity on the silicon resistivity and on …
previously reported dependence of the measured permittivity on the silicon resistivity and on …
Pseudo-labeling and clustering-based active learning for imbalanced classification of wafer bin map defects
S Manivannan - Signal, Image and Video Processing, 2024 - Springer
Wafer bin map (WBM) defect patterns play a crucial role in identifying the root cause of
manufacturing defects in the semiconductor industry. Although various deep learning-based …
manufacturing defects in the semiconductor industry. Although various deep learning-based …
Wafer Defect Identification with Optimal Hyper-Parameter Tuning of Support Vector Machine using the Deep Feature of ResNet 101
As semiconductor processing technologies continue to advance, semiconductor wafers are
becoming more densely packed and intricate, resulting in a higher incidence of surface …
becoming more densely packed and intricate, resulting in a higher incidence of surface …
Wafer defect identification with optimal hyper-parameter tuning of support vector machine using the deep feature of ResNet 101
As semiconductor processing technologies continue to advance, semiconductor wafers are
becoming more densely packed and intricate, resulting in a higher incidence of surface …
becoming more densely packed and intricate, resulting in a higher incidence of surface …