Micro-electromechanical Systems (MEMS) Directional Acoustic Sensors for Underwater Operation

G Karunasiri, FDP Alves - US Patent App. 17/496,674, 2023 - Google Patents
2022-07-15 Assigned to THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE
SECRETARY OF THE NAVY reassignment THE UNITED STATES OF AMERICA, AS …

Sensor with chamber

YF Tzeng, C Huang, YH Liao, CH Tsai, TC Lee… - US Patent …, 2023 - Google Patents
2021-04-19 Assigned to AI Nose Corporation reassignment AI Nose Corporation
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

Capless semiconductor package with a micro-electromechanical system (MEMS)

JS Talledo - US Patent 11,897,763, 2024 - Google Patents
A semiconductor package that contains an application-specific integrated circuit (ASIC) die
and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are …