The electronic equipment develo** towards miniaturization and high integration is facing
the danger of high heat flux and non-uniform temperature distribution which leads to the …

Increasing complexity of electronic devices and chips places increasingly stringent
requirements on heat sinks. A novel manifold microchannel heat sink with …

The utilization of a hierarchical microstructure and three-dimensional (3D) manifold for liquid
delivery and liquid/vapor extraction could potentially improve the single-phase/two-phase …

Tesla valve is check valve with no-moving-part, which cannot completely suppress reverse
flow but has better reliability and flexibility than check valve with moving-part. Diodicity is …

Targeting at improving the comprehensive performance of microchannel heat sink,
microchannel heat sinks integrated with various arrangements of micro pin-fins arrays are …

Targeted at addressing practical thermal issues of 3D-IC chip, heat transfer characteristics
and temperature uniformity of gradient distribution solid and annular-cavity micro-pin fins are …

Hydrogen fuel has great application prospect in micro combustion power systems because
of its great advantages. The combustion characteristics of bluff body and cavity combined …

Thermal performance of the pin-fin heat sink cooled by natural convection is numerically
investigated when the fin density is allowed to vary along the flow direction. The distribution …

As the characteristic size continue to decrease and integration and output power continue to
increase, the heat flow density of electronic chips and the risk of thermal failure increase …

Targeting at decreasing the pressure drop in the micro heat sink, a gradient distribution pin
fin arrays and narrow slots (GPN) is proposed. In addition, in order to further reduce the …