Portable electronic products are continuously evolving towards compactness, integration,
and high performance, resulting in electronic chips generating significant heat in a confined …

The increasing heat flux of electronic systems, caused by the miniaturization and high
integration, has posed a huge challenge to efficient and effective thermal management …

Four aluminum flat grooved heat pipes with groove widths of 0.2, 0.4, 0.8 and 1.6 mm are
fabricated and the effect of filling ratio on the thermal performance is experimentally studied …

The rapid size shrinkage and the increasing power of the chip made it increasingly
challenging to dissipate the heat generated by electronics. Ultra-thin flat heat pipes …

The length of the evaporation or condensation section has a significant impact on
conventional heat pipe or copper flat heat pipe heat transfer performance. Based on this …

Flat grooved heat pipes (HPs) have become essential in advanced thermal management
solutions across various engineering applications. Modeling these devices, especially …

This study delves into the exploration of flow and heat transfer characteristics within a silicon-
based ultra-thin flat-grooved heat pipe (UFHP) featuring double-end cooling based on a …

Comprehensive numerical simulations are made to examine the combined effect of three
distinct passive techniques: partial porous insert, corrugated walls, and hybrid nanofluid on …

Passive thermal spreaders utilizing liquid/vapor phase-change mechanism such as heat
pipes, have been widely used in the macro-scale thermal management of electronic devices …

Mathematical modeling of grooved heat pipes is a challenging task since multiple coupled
physical phenomena such as phase change, free-surface flow and heat transfer are …