Energy aware edge computing: A survey

C Jiang, T Fan, H Gao, W Shi, L Liu, C Cérin… - Computer …, 2020 - Elsevier
Edge computing is an emerging paradigm for the increasing computing and networking
demands from end devices to smart things. Edge computing allows the computation to be …

[HTML][HTML] The fabrication and bonding of thermoplastic microfluidics: A review

A Shakeri, S Khan, NA Jarad, TF Didar - Materials, 2022 - mdpi.com
Various fields within biomedical engineering have been afforded rapid scientific
advancement through the incorporation of microfluidics. As literature surrounding biological …

Miniaturization of fluorescence sensing in optofluidic devices

D Măriuţa, S Colin, C Barrot-Lattes, S Le Calvé… - Microfluidics and …, 2020 - Springer
Successful development of a micro-total-analysis system (µTAS, lab-on-a-chip) is strictly
related to the degree of miniaturization, integration, autonomy, sensitivity, selectivity, and …

Effects of interface structure on the mechanical properties and deformation mechanisms of copper–tantalum interface via molecular dynamic simulation

Z Gao, C Sheng, S Wang, L Xue… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Through silicon via (TSV) is a core technology in 3-D integration. Interface failure is one of
the most noted failure forms of TSV. The barrier layer Ta, which is between the media Cu …

System technology co-optimization for advanced integration

S Pal, A Mallik, P Gupta - Nature Reviews Electrical Engineering, 2024 - nature.com
Advanced integration and packaging will drive the scaling of computing systems in the next
decade. Diversity in performance, cost and scale of the emerging systems implies that …

[HTML][HTML] A scalable and low stress post-CMOS processing technique for implantable microsensors

AH Lee, J Lee, F Laiwalla, V Leung, J Huang… - Micromachines, 2020 - mdpi.com
Implantable active electronic microchips are being developed as multinode in-body sensors
and actuators. There is a need to develop high throughput microfabrication techniques …

A 10 M, 50 kHz-40 MHz Impedance Measurement Architecture for Source-Differential Flow Cytometry

B Shen, J Dawes, ML Johnston - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
A low-power, impedance-based integrated circuit (IC) readout architecture is presented for
cell analysis and cytometry applications. A three-electrode layout and source-differential …

Microfluidic lab-on-CMOS packaging using wafer-level molding and 3D-printed interconnects

J Dawes, TH Chou, B Shen… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Lab-on-a-chip (LoC) technologies continue to promise lower cost and more accessible
platforms for performing biomedical testing in low-cost and disposable form factors. Lab-on …

Warpage analysis and prediction of the advanced fan-out technology based on process mechanics

S Wang, Y Sun, C Sheng, Z Feng, R Li… - IEEE Transactions …, 2021 - ieeexplore.ieee.org
Moore's law has remarkably promoted the development of semiconductor technology over
the last decades. The advanced packaging involving novel materials, structures, and …

Integration of a Microfluidics System with a U-shaped Optical Fiber Sensor for Sensing Various Concentrations of Glucose

HC Hsu, TB Tran, TTV Nguyen, HD Le… - IEEE Sensors …, 2024 - ieeexplore.ieee.org
This study introduces a successfully manufactured U-shaped optical fiber sensor integrated
with a microfluidics system to detect varying glucose concentrations. It outlines the …