This overview reports the fundamental concepts of grain boundary engineering (GBE)
accompanied by a critical appraisal of GBE investigations. The main conclusions are as …

Copper and its alloys generally display a severe reduction in ductility between roughly 300
and 600° C, a phenomenon variously called 'intermediate temperature embrittlement'or …

Grain boundary engineering (GBE) is considered to be an attractive approach to
microstructure control, which significantly enhances the grain-boundary-related properties of …

Grain boundary engineering (GBE) has lately been recognized as a viable approach to
manipulate grain boundary characteristics to improve resistance against intergranular …

Grain boundary character distributions (GBCD) of type 304 stainless steel cold rolled and
then annealed at 1173K were analyzed by electron back scatter diffraction (EBSD). The …

Titanium thin film has been commonly used in the semiconductor industry as an adhesive
layer to enhance the bonding strength between a metallic film and Si substrate. Depositing a …

The application of the electron backscatter diffraction technique to the investigation of phase
transformations is reviewed. The wide variety of results obtained using this technique is …

In this study the effect of the weld current on the microstructure and mechanical properties of
a resistance spot-welded twinning-induced plasticity (TWIP) steel sheet was investigated …

Recrystallized Pb–0.05% Ca–1.5% Sn–0.026% Al (mass fraction) alloy, with an averaged
grain size of 20–30μm, special grain boundary (Σ1–Σ29) fraction of less than 40% and the …

In a Ag–8Au–3Pd wire, a large number of annealing twins can be observed. In contrast to
the rapid grain growth in Au and Cu wires during aging at 600° C, the grain size of this Ag …