Thermal control of electronic components using phase-change materials (PCMs) in heat
sinks is an efficient method that has attracted the attention of numerous researchers …

With the rapid development in the electronics industry, the thermal management of high
power density electronic products (HPDEPs) has become very important and requires …

Metal foam heat sinks (MFHSs) are often used for electronic cooling because of their high
specific heat transfer surface area, fluid mixing capability, and lightweight. Thermal-hydraulic …

Electronics often experience overheating, which occurs when insufficient or improper
cooling causes temperatures to rise quickly, potentially leading to component failure …

Data centers are increasingly important for global societal and economic advancement. The
reliable operation of data centers depends on robust thermal management systems for …

Due to their unique heat transfer features, graphitic foams have been used in the current
analysis to form heat sinks effective enough to dissipate extreme heat generated within high …

Positive temperature coefficient (PTC) material with high resistance-temperature coefficient
has excellent adaptive temperature control performance. In this paper, a positive …

Open-cell metal foams are known for their superior heat dissipation capabilities. The
morphological, pressure drop, and heat transfer characteristics of stochastic metal foams …

The shape and stacking method of the packing elements will affect the overall performance
of the packed bed structure. In this study, the convection heat transfer in packed beds was …

We investigate the effective heat transfer in complex systems involving porous media and
surrounding fluid layers in the context of mathematical homogenization. We differentiate …