[HTML][HTML] Carbon nanotube reinforced cementitious composites: A comprehensive review

M Ramezani, A Dehghani, MM Sherif - Construction and Building Materials, 2022 - Elsevier
During the past decade, researchers investigated the incorporation of carbon nanotubes
(CNTs) as a reinforcement for cementitious materials to achieve multifunctional properties …

Eco‐friendly electronics—a comprehensive review

MP Cenci, T Scarazzato, DD Munchen… - Advanced Materials …, 2022 - Wiley Online Library
Eco‐friendliness is becoming an indispensable feature for electrical and electronic
equipment to thrive in the competitive market. This comprehensive review is the first to …

Systematic physics-compliant analysis of over-the-air channel equalization in RIS-parametrized wireless networks-on-chip

J Tapie, H Prod'homme, MF Imani… - IEEE Journal on …, 2024 - ieeexplore.ieee.org
Wireless networks-on-chip (WNoCs) are an enticing complementary interconnect
technology for multi-core chips but face severe resource constraints. Being limited to simple …

[KİTAP][B] Fundamentals of electromigration

J Lienig, M Thiele, J Lienig, M Thiele - 2018 - Springer
This chapter investigates in detail the actual low-level migration processes. A solid
grounding in the physics of electromigration (EM) and its specific effects on the interconnect …

Nanoscale patterning of carbon nanotubes: techniques, applications, and future

A Corletto, JG Shapter - Advanced Science, 2021 - Wiley Online Library
Carbon nanotube (CNT) devices and electronics are achieving maturity and directly
competing or surpassing devices that use conventional materials. CNTs have demonstrated …

[HTML][HTML] Recent progress and challenges regarding carbon nanotube on-chip interconnects

B Xu, R Chen, J Zhou, J Liang - Micromachines, 2022 - mdpi.com
Along with deep scaling transistors and complex electronics information exchange networks,
very-large-scale-integrated (VLSI) circuits require high performance and ultra-low power …

Graphene-based wireless agile interconnects for massive heterogeneous multi-chip processors

S Abadal, R Guirado, H Taghvaee… - IEEE Wireless …, 2022 - ieeexplore.ieee.org
The main design principles in computer architecture have recently shifted from a monolithic
scaling-driven approach to the development of heterogeneous architectures that tightly co …

Graphene and carbon nanotubes for electronics nanopackaging

G Boschetto, S Carapezzi… - IEEE Open Journal of …, 2021 - ieeexplore.ieee.org
In recent years, the aggressive downscaling of electronic components has led to highly
dense and power-hungry devices. With Moore's law expected to soon reach its physical …

A modeling study on electrical and thermal behavior of CNT TSV for multilayer structure

B Xu, R Chen, J Zhou, J Liang - IEEE Transactions on Electron …, 2023 - ieeexplore.ieee.org
Carbon nanotube (CNT) is recently proposed as an alternative material for through-silicon
via (TSV) to meet the requirements for high-density scaling and 3-D stacking. In this article …

Investigation of Pt-salt-doped-standalone-multiwall carbon nanotubes for on-chip interconnect applications

J Liang, R Chen, R Ramos, J Lee… - … on Electron Devices, 2019 - ieeexplore.ieee.org
In this paper, we investigate, by combining electrical measurements with an atomistic-to-
circuit modeling approach, the conductance of doped standalone multiwall carbon …