Electronic devices play a vital role in our lives and are expected to play an even bigger role
in the future considering their immense contribution in every field. Current trends are drifting …

Hexagonal boron nitride (h-BN)/epoxy composites with high through-plane thermal
conductivity were successfully fabricated using core-shell h-BN/epoxy (e-BN) microspheres …

High-performance thermal management materials are essential in miniaturized, highly
integrated, and high-power modern electronics for heat dissipation. In this context, the large …

Due to the high-heat flux issue caused by the increasing power consumption of electronic
devices in spacecraft, there is an urgent need but still a significant challenge to develop high …

Low thermal conductivity and poor shape stability have seriously limited the wide application
of phase change materials (PCMs). To enhance the thermal conductivity without …

One of the most important physical factors related to the thermal conductivity of composites
filled with graphene nanoplatelets (GNPs) is the dimensions of the GNPs, that is, their lateral …

Carbon-based fillers for thermal interface materials (TIMs) are attractive due to their
advantages such as high thermal conductivity, low thermal expansion, mechanical strength …

In this work, a lightweight and flexible composite paper has been successfully fabricated by
incorporating nanofibrillated cellulose (NFC) with graphite nanoplatelets (GNPs). The NFC …

Graphene nanoplatelet (GNP) doped epoxy/polycaprolactone (PCL) blends have been
proposed in the present work. It has been observed that the addition of GNPs induces an …

Abstract A three-dimensional (3D) carbon nanotube/exfoliated graphite block (CNT/EGB)
was prepared by growing vertical aligned carbon nanotube (VACNT) at the surface of SiO 2 …