The pursuit of greater performance in microelectronic devices has led to a shrinkage of
bump size and a significant increase in electrical current. This has resulted in a high current …

This second edition adds new sections on derivation of dynamic equilibrium equations in
unified mechanics theory and solution of an example, derivation of very high cycle fatigue …

Microstructural evolution and interfacial reaction in the eutectic SnBi solder joint on the Ni/Au
metallization with and without the current stressing of 6.5× 10 3 A/cm 2 at 70° C for 5 to 15 …

Reliability of solder joints under Electromigration (EM) and Thermomigration (TM) has drawn
increasing attention in recent years, however current understanding regarding degradation …

Electromigration is a major road block in the pursuit of nanoelectronics and next generation
power electronics. The current density in the state-of-the-art microelectronics solder joints is …

In this work, the effect of minor Ag addition on shear performance of ball grid array (BGA)
structure Cu/SnBi/Cu solder joints under electric current stressing was investigated. The …

Sn–58Bi eutectic solder is attracted much attention to replace Sn–Ag–Cu Pb-free solder due
to its lower melting temperature in recent years. However, its low melting temperature also …

Effects of current stressing of 6.5× 10 3 A/cm 2 on the eutectic SnBi solder joint at 70° C were
investigated. The Bi segregation at the anode side was found, and the Bi segregation layer …

Effects of silver do** on electromigration behavior of the eutectic SnBi solder are
investigated. Electromigration can induce the Bi migration along with the direction of …

In this study, alternating current (ac) electromigration (EM) degradation simulations were
carried out for Sn95. 5% Ag4. 0% Cu0. 5 (SAC405-by weight) solder joints. Mass transport …