A comprehensive guide to antenna design, manufacturing processes, antenna integration,
and packaging Antenna-in-Package Technology and Applications contains an introduction …

An antenna-in-package solution is introduced for millimeter-wave applications. The solution
is implemented in an asymmetric PCB technology incorporating 4 laminates of a Teflon …

A three-dimensional packaging solution is introduced for wireless sensor network nodes at
microwave frequencies. The package has a cubic geometry with radiating antennas on its …

An antenna element suitable for antenna-in-package solutions at millimeter wave
frequencies is introduced. The antenna is composed of a circular patch which is fed with a …

A multi-layer PCB technology is used to implement an antenna-in-package solution for
millimeter-wave-frequency applications. The antenna is a 1× 2 array of dipoles fed by a …

An antenna-in-package solution implemented in a multi-layer PCB technology is introduced.
The antenna is a slotted patch which is fed by a CPW line through a capacitive coupling …

The most important characteristic of an antenna, especially when integrated solutions for
mass production are of interest, is the physical limit imposed on the antenna dimensions. A …

Two multilayer technologies have been used two introduce antenna-in-package solutions
for millimeter wave applications such as multi-gigabit-per-second communication …

Abstract We present Coplanar-Planar Goubau Line (PGL) transitions designed on high-
resistivity Silicon to characterize a PGL using microwave probing. These transitions are …