Power modules are core components of inverters in electric vehicles and their packaging
technology has a critical impact on system performance and reliability. Conventional single …

Due to their superior material properties, wide bandgap (WBG) semiconductors enable the
application of power electronics at higher temperature operation, higher frequencies, and …

This paper proposes a packaging method for SiC MOSFETs that provides a feasible solution
of implementing press-pack packaging on SiC MOSFETs to extend the application of SiC …

This paper presents a vision for the future of 3D packaging and integration of silicon carbide
(SiC) power modules. Several major achievements and novel architectures in SiC modules …

Power modules are the core components of the powertrain of hybrid and battery electric
vehicle (EV) and has a significant impact on system performance and reliability …

As the power density of electric vehicles continues to increase, double-sided cooling
technology has emerged as a focal point of research. However, the complexity of double …

To press-pack devices, higher packaging resistance results in higher conduction losses. In
this paper, compositions of the packing resistance are studied for a press-pack SiC …

The SiC MOSFET die is more sensitive to stray inductance than IGBT device. One of the key
layout point for the SiC MOSFET module is that the stray inductance for each die should be …

A microchannel heat sink integrated with a three-dimensional manifold using direct bonded
copper (DBC) is promising for high power density electronics due to the combination of low …

Power electronics plays a vital role in various applications, from household devices to
electric vehicles and renewable energy systems. In Denmark, the power electronics sector is …