Recent years have witnessed significant progress in quantum communication and quantum
internet with the emerging quantum photonic chips, whose characteristics of scalability …

Moore's Law is a techno-economic model that has enabled the information technology
industry to double the performance and functionality of digital electronics roughly every 2 …

Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before
they can be integrated into functional optoelectronic systems. Photonic packaging is …

As Deep Learning (DL) models grow larger and more complex, training jobs are
increasingly distributed across multiple Computing Units (CU) such as GPUs and TPUs …

Placing the electrical and photonic chiplets in a single package leads to significant power
reduction. Chiplets are connected by fine-line electrical routing over a length of a few …

In this paper we present PolarFly, a diameter-2 network topology based on the Erdos-Renyi
family of polarity graphs from finite geometry. This is the first known diameter-2 topology that …

In this study, we focus on the development of key processes towards wafer-scale 3-
dimentional/vertical (3D) integration of Indium-Phosphide (InP) photonic membranes on InP …

The thermal-flow-stress coupling model of multi-chip module with uniform heat generation
under natural convection condition is established. Taking the chip aspect ratio and edge …

The diversity of workload requirements and increasing hardware heterogeneity in emerging
high performance computing (HPC) systems motivate resource disaggregation. Resource …

We review the motivation, goals, and achievements of the Photonic Integrated Networked
Energy efficient datacenter (PINE) project, which is part of the Advanced Research Projects …