Second-harmonic microscopy of strain fields around through-silicon-vias
Through-Silicon-Vias (TSVs)—10 μm-diameter conducting rods that connect vertically
stacked silicon layers—provide three dimensional circuit integration, but introduce strain in …
stacked silicon layers—provide three dimensional circuit integration, but introduce strain in …
Optical characterization of emerging electronic and ferroelectric materials and structures
Y Cho - 2019 - repositories.lib.utexas.edu
My Ph. D. work is on altering material properties to improve or apply in device applications
and probing the manipulated properties through linear/nonlinear optical methods. I focused …
and probing the manipulated properties through linear/nonlinear optical methods. I focused …