An integrated heat sink with vapor chamber (IHSVC) is developed in this study for the
thermal management of high-power light-emitting diodes (LEDs). The wick, as a key …

The efficacy of light-emitting diode cooling is anomalously augmented by deploying
nucleate boiling on graphene-nanoplatelets coated surface at sub-atmospheric pressures …

In current paper, a finned micro-channel is designed for the cooling application in Light
Emitting Diode (LED), numerically using Galerkin weighted residual Finite Element Method …

Thermal issues limit the application and development of electronic technique. In this work,
temperature-sensitive poly (N-isopropylacrylamide)(PNIPA) hydrogel is used to dissipate …

Building integrated photovoltaic modules, applied to industrial and commercial buildings,
generally used metal as the backsheet. In summer, the operating temperature of modules is …

In this study, a new heat dissipation device with a composite heat sink of a loop heat pipe
(LHP) system was evaluated for efficient cooling of electronic components. To improve the …

In order to better solve the thermal management of high-power LED and facilitate its
miniaturization, an active-passive combined heat dissipation method based on a dual …

Various types of nanoporous anodic aluminum oxide layers and their sealings were studied
to enhance the thermal emissivity and hence improve the heat dissipation of aluminum alloy …

Multi-functional porous coatings are promising candidates to improve overall heat transfer
performances of heat sinks that are essential for thermal management of various electronic …

To address the application challenges of high-power-density electronic devices in harsh
conditions, it is crucial to develop electric insulation materials that possess both corrosion …