Diamond wire sawing of solar silicon wafers: a sustainable manufacturing alternative to loose abrasive slurry sawing

A Kumar, SN Melkote - Procedia Manufacturing, 2018 - Elsevier
Slicing silicon wafers for solar cells and micro-electronic applications by diamond wire
sawing has emerged as a sustainable manufacturing process with higher productivity …

A review on cutting of industrial ceramic materials

R Rakshit, AK Das - Precision Engineering, 2019 - Elsevier
Ceramics have garnered huge engineering applications in various manufacturing industries.
This is due to their excellent mechanical properties at high temperature, good oxidation …

Corrosion of ultra-high-purity Mg in 3.5% NaCl solution saturated with Mg (OH) 2

F Cao, Z Shi, J Hofstetter, PJ Uggowitzer, G Song… - Corrosion …, 2013 - Elsevier
Corrosion was evaluated for ultra-high-purity magnesium (Mg) immersed in 3.5% NaCl
solution saturated with Mg (OH) 2. The intrinsic corrosion rate measured with weight loss …

Wire sawing technology: A state-of-the-art review

H Wu - Precision engineering, 2016 - Elsevier
Wire sawing technology has been widely adopted for slicing of brittle-and-hard materials
including crystalline silicon, SiC and sapphire. This paper presents a literature review on the …

Modelling and experimental investigations of microcracks in crystalline silicon photovoltaics: A review

L Papargyri, M Theristis, B Kubicek, T Krametz… - Renewable Energy, 2020 - Elsevier
In recent years, the scientific research into photovoltaic (PV) technology has focused on the
failure modes in order to increase the PV reliability, durability and service lifetime. One of the …

Influence of single diamond wire sawing of photovoltaic monocrystalline silicon on the feed force, surface roughness and micro-crack depth

EC Costa, WL Weingaertner, FA Xavier - Materials science in …, 2022 - Elsevier
To gain an in-depth understanding of the influence of diamond wire sawing of
monocrystalline silicon on the feed force and wafer quality, experiments with a single …

Surface formation, morphology, integrity and wire marks in diamond wire slicing of mono-crystalline silicon in the photovoltaic industry

J Qiu, X Li, R Ge, C Liu - Wear, 2022 - Elsevier
The diamond wire sawing is superior for the wafers manufacturing in the photovoltaic and
semiconductor industry. In this research, analytical models were emphasized and …

Experiment and theoretical prediction for subsurface microcracks and damage depth of multi-crystalline silicon wafer in diamond wire sawing

X Li, Y Gao, R Liu, W Zhou - Engineering Fracture Mechanics, 2022 - Elsevier
Diamond wire saw slicing is an important process of multi-crystalline silicon (mc-Si) solar
cell substrate processing. In wire sawing of silicon crystal, the brittleness removal of …

Study of ductile-to-brittle transition in single grit diamond scribing of silicon: application to wire sawing of silicon wafers

H Wu, SN Melkote - Journal of Engineering …, 2012 - asmedigitalcollection.asme.org
The ductile-to-brittle cutting mode transition in single grit diamond scribing of
monocrystalline silicon is investigated in this paper. Specifically, the effects of scriber tip …

Manufacturing metrology for c-Si module reliability and durability Part II: Cell manufacturing

KO Davis, MP Rodgers, G Scardera, RP Brooker… - … and Sustainable Energy …, 2016 - Elsevier
This article is the second article in a three-part series dedicated to reviewing each process
step in crystalline silicon (c-Si) photovoltaic (PV) module manufacturing process: feedstock …