Electrical Modeling of Near-Field Coupling Inside Integrated Heterogeneous Packages
GSG Al-Duhni, M Khasgiwala… - 2024 International …, 2024 - ieeexplore.ieee.org
This paper presents prediction models for capacitive and inductive coupling between
passive and active packaged components. The model uses mutual inductance and …
passive and active packaged components. The model uses mutual inductance and …