As advanced silicon manufacturing processes slow down in scaling, three-dimensional
stacking of chips has become a future trend in microelectronic industry. High-density …

In this study, different weight fractions (0, 0.2, 0.5, 0.7, and 1.0 wt%) of cerium oxide (CeO 2)
nanoparticles were used to enhance the properties of Sn–58Bi–1Ag (SBA) solder alloys. As …

Resin-reinforced Ag sintering materials represent a promising solution for die-attach
applications in high-power devices requiring enhanced reliability and heat dissipation …

This study investigates Cu single-sided solder joints using hybrid soldering (In+ Sn58Bi) at
reflow temperatures ranging from 80 to 130° C. The wetting angles of 27° at 90° C and 22° …

SnPb solder was widely used in electronic packaging for aerospace devices due to its high
reliability. However, its creep resistance is poor and can be improved by adding alloying …

This study investigated the fusion and phase-transformation processes of nano-intermetallic
compound (nano-IMC) mixed solder pastes. In particular, the interfacial reaction with the Cu …

Complex structures have recently found extensive application in flexible electronics systems,
including wearable electronics, electronic textiles, and structural health monitoring. Owing to …

In this study, the properties of solder joints were compared after bonding process using
different energy sources. Various soldering methods were employed, including reflow, laser …

Low-temperature soldering is a joining technology that attracts considerable attention in
recent years due to its potential in energy saving and carbon reduction. Eutectic SnBi alloy is …

The solder wettability is a key factor for assessing joint reliability. However, the extensive
range of solder composition, substrate material and reflow temperature make it challenging …